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Promising predictions are made for III-V tunnel-field-effect transistor (FET), but there is still uncertainty on the parameters used in the band-to-band tunneling models. Therefore, two simulators are calibrated in this paper; the first one uses a semi-classical tunneling model based on Kane's formalism, and the second one is a quantum mechanical simulator implemented with an envelope function formalism. The calibration is done for In 0.53 Ga 0.47 As using several pþ/intrinsic/nþ diodes with different intrinsic region thicknesses. The dopant profile is determined by SIMS and capacitance-voltage measurements. Error bars are used based on statistical and systematic uncertainties in the measurement techniques. The obtained parameters are in close agreement with theoretically predicted values and validate the semi-classical and quantum mechanical models. Finally, the models are applied to predict the input characteristics of In 0.53 Ga 0.47 As n-and p-lineTFET, with the n-lineTFET showing competitive performance compared to MOSFET. V

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InGaAs homojunction Tunnel FET devices are demonstrated with sub-60 mV/dec Sub-threshold Swing (SS) measured in DC. A 54 mV/dec SS is achieved at 100 pA/lm over a drain voltage range of 0.2-0.5 V. The SS remains sub-60 mV/dec over 1.5 orders of magnitude of current at room temperature. Trap-Assisted Tunneling (TAT) is found to be negligible in the device evidenced by low temperature dependence of the transfer characteristics. Equivalent Oxide Thickness (EOT) is found to play the major role in achieving sub-60 mV/dec performance. The EOT of the demonstrated devices is 0.8 nm.