The inline manufacturing equipment using a combination of the belt source and LPS source which is innovatively designed is introduced for the large-size AMOLED. The features of the inline system include 60sec TACT time, 19 numbers of chambers, non-substrate bending and easy application to very thin TFT substrates for the 4P th P -8P th P Generation AMOLEDs.
The vacuum thermal evaporation (VTE) patterning technique using linear type evaporation sources has 3μm of minimum shadow distance so that the high resolution (577ppi, 2K QHD) AMOLED can be manufactured. However, there is a shadow limitation of the neighboring patterns overlapped when manufacturing the ultra-high resolution (800ppi, 4K UHD) AMOLED. The plane source VTE shows recently of 1.1μm~1.3μm in shadow distance measurements and it verifies the possibility of manufacturing the ultra-high resolution AMOLEDs with 1000~1500ppi. The shadow angle of 83° and shadow distance of 0.37μm have been predicted from the plane source AFM analysis and, therefore, it shows high possibility of manufacturing the super-ultra-highAMOLEDs with 3300ppi. The study of plane source evaporation and its evaporator need to be expanded for the AMOLED futures.
The flash sintering process has been regarded as a noble method to densify ceramic materials. The distinctive feature of the flash sintering is the reduced sintering time which is caused by the electric field. In this study, flash sintering of the hydroxyapatite bioceramics was carried out at temperatures of 900-1200°C and electric fields of 500-1200 V/cm. Dense sintered sample was prepared in a short time within 10 seconds. Electric field required for flashing became reduced as the furnace temperature increased. Abrupt rise of the sample temperature of up to 120°C was observed when the flash occurred. The incubation time for flashing became shorter with increasing temperature and electric field. The flashing was found to occur at lower temperature and lower electric field in vacuum than in air. Microstructure of the flash sintered sample was not different from that of conventionally sintered sample.
The linear source FMM evaporation can only provide 600ppi AMOLED devices because of the shadow effect so that new concept of FMM patterning technology is needed in order to fabricate the 2250ppi AMOLEDs. Recently, the plane source FMM evaporation techniques has been developed to show a dramatically suppressed shadow effect and to measure the 0.18um of shadow distance and Hwang's mixing for the new way of EML layer process. The green color OLED device has been fabricated by the plane source evaporation to study the emission property for the first time. In addition, the fabrication process of the plane source FMM evaporator has been discussed for the 2250ppi flexible AMOLED.
Whether the manufacturing of the large‐size OLED devices succeeds or not will strongly depend on the concept of a thermal evaporation source. The most important factors in OLED device manufacturing are the organic material utilization and the TACT time. We propose an in‐line type equipment for OLED manufacturing using a novel plane evaporation source. The plane source maintains the organic film uniformity at 5% and provides high material utilization of over 60% and the proposed in‐line system can achieve in 1 min. TACT time.
There are two type evaporators such as cluster and inline equipped with linear sources in OLED manufacturing. The inline type evaporator has been used for WOLED and QD‐OLED and there is a glass substrate bending problem in 10G size manufacturing. The cluster type evaporator has been used for AMOLED and there is a shadow distance limitation to improve the display resolution. The belt plane source FMM evaporator and the vertical belt plane source evaporator equipped with three dimensional shape plane sources will be used for very high ppi (pixel per inch) AMOLED and 10G OLED TV device, respectively. They are the ultimate evaporator‐solutions.
The AMOLED has a limitation in ppi(pixel per inch) resolution due to the shadow phenomenon in doing evaporation deposition process and the QD-OLED TV device has a limitation in substrate size due to the glass bending during evaporation deposition process. Using the plane source evaporation deposition, the AMOLED resolution can be improved up to 2250ppi and the blue organic film of 12G size glass can be deposited uniformly. The mass production of very high ppi AMOLED and 77" QD-OLED TV will be realized by unique belt plane source evaporator which can supply the continuous plane source evaporation process.
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