We are developing small-pixel transition-edge-sensor (TES) for solar physics and astrophysics applications. These large format close-packed arrays are fabricated on solid silicon substrates and are designed to accommodate count-rates of up to a few hundred counts/pixel/second at a FWHM energy resolution -2 eV at 6 keV. We have fabricated versions that utilize narrow-line planar and stripline wiring. We present measurements of the performance and uniformity of kilo-pixel arrays, incorporating TESs I1Hh single 65-micron absorbers on a 7s-micron pitch, as wen as versions with more than one absorber attached to the TES, 4-absorber and 9-absorber "Hydras". We have also fabricated a version of this detector optimized for lower energies and lower count-rate applications. These devices have a lower superconducting transition temperature and are operated just above the 40mK heat sink temperature. This results in a lower heat capacity and low thermal conductance to the heat sink. With individual single pixels of this type we have achieved a FWHM energy resolution of 0.9 eV with 1.5 keV Al K x-rays, to our knowledge the first x-ray microcalorimeter with sub-eV energy resolution. The 4-absorber and 9-absorber versions of this type achieved FWHM energy resolutions of 1.4 eV and 2.1 eV at 1.5 keV respectively. We will discuss the application of the se devices for new astrophysics mission concepts.https://ntrs.nasa.gov/search.jsp?R=20120011612 2018-05-12T07:47:57+00:00Z
Micro Electromechanical System (MEMS) microshutter arrays are being developed at NASA Goddard Space Flight Center for use as a field selector of the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). The microshutter arrays are designed for the spontaneous selection of a large number of objects in the sky and the transmission of light to the NIRSpec detector with high contrast. The JWST environment requires cryogenic operation at 35K. Microshutter arrays are fabricated out of silicon-on-insulator (SOI) silicon wafers. Arrays are closepacked silicon nitride membranes with a pixel size of 100x200 m. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. Light shields are processed for blocking light from gaps between shutters and frames. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes multi-layer metal depositions, the patterning of magnetic stripes and shutter electrodes, a reactive ion etching (RIE) to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch to form mechanical supporting grids and release shutters from the silicon substrate. An additional metal deposition is used to form back electrodes. Shutters are actuated by a magnetic force and latched using an electrostatic force. Optical tests, addressing tests, and life tests are conducted to evaluate the performance and the reliability of microshutter arrays.
For future X-ray astrophysics missions, X-ray microcalorimeters can be optimized with different properties in different regions of the focal plane. This approach has the potential to improve microcalorimeter instrument capabilities with efficient use of instrument resources. For example a point-source array optimized for high angular resolution, high count-rate observations could be accompanied by a main array to expand the field of view for diffuse observations. In this approach, it is desirable to be able to simultaneously optimize different transition-edge sensor (TES) geometries on a single wafer design. The key properties of TESs such as transition temperature and shape are a strong function of size and geometry due to the complex interplay between the proximity effect from the superconducting bias electrodes and the normal metal features used for noise suppression and absorber contact. As a result, devices fabricated with the same deposited layer but with different sizes will have different transition temperatures and Manuscript
We are developing superconducting transition-edge sensor (TES) microcalorimeter focal planes for versatility in meeting specifications of X-ray imaging spectrometers including high count-rate, high energy resolution, and large field-of-view. In particular, a focal plane composed of two sub-arrays: one of fine-pitch, high count-rate devices and the other of slower, larger pixels with similar energy resolution, offers promise for the next generation of astrophysics instruments, such as the X-ray Integral Field Unit (X-IFU) instrument on the European Space Agency's Athena mission. We have based the sub-arrays of our current design on successful pixel designs that have been demonstrated separately. Pixels with an all gold X-ray absorber on 50 and 75 micron scales where the Mo/Au TES sits atop a thick metal heatsinking layer have shown high resolution and can accommodate high count-rates. The demonstrated larger pixels use a silicon nitride membrane for thermal isolation, thinner Au and an added bismuth layer in a 250 micron square absorber. To tune the parameters of each sub-array requires merging the fabrication processes of the two detector types. We present the fabrication process for dual production of different X-ray absorbers on the same substrate, thick Au on the small pixels and thinner Au with a Bi capping layer on the larger pixels to tune their heat capacities. The process requires multiple electroplating and etching steps, but the absorbers are defined in a single ion milling step. We demonstrate methods for integrating heatsinking of the two types of pixel into the same focal plane consistent with the requirements for each sub-array, including the limiting of thermal crosstalk. We also discuss fabrication process modifications for tuning the intrinsic transition temperature (T) of the bilayers for the different device types through variation of the bilayer thicknesses. The latest results on these "hybrid" arrays will be presented.
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