&lt;title&gt;Fabrication of microshutter arrays for space application&lt;/title&gt;

Li, Mary J.; Aslam, Imran; Ewin, Audrey J.; Fettig, Rainer K.; Franz, David E.; Kotecki, Carl A.; Kutyrev, A.; Moseley, S. H.; Monroy, C.; Mott, D. B.; Zheng, Yun

doi:10.1117/12.425314

Cited by 10 publications

(12 citation statements)

References 2 publications

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“…Several facilities were assembled to evaluate the electrical, optical and mechanical performance of all 249,660 shutters individually. Optical results identified all shutters with contrast below 10 4 for repair and demonstrated that average shutter contrast far exceeds the 10 4 requirement. This level of performance confirms that the NIRSpec instrument will be adequately efficient to meet JWST"s goal of observing 2500 galaxies in five years.…”

Section: Discussionmentioning

confidence: 99%

“…The MSA latching process works by scanning a magnet behind the array so that shutters are rotated downward until they are electrostatically held open by the structure walls. 10 Applying sufficient electrical bias via a cross-addressing method holds selected shutters open to form a desired pattern. Shutters not addressed with sufficient "hold" voltage are returned to their released position by their spring-like torsion hinge.…”

Section: Design and Function Of The Microshutter Assemblymentioning

confidence: 99%

“…8 The DDL employed a combination of microlithography techniques to form the shutter structure including a unique Deep Reactive Ion Etch (DRIE) process to create the rear "egg crate" support structure. 9 The DDL fabrication process includes coating each shutter blade with thin bands of CoFe. This ferrous material allows each shutter to be magnetically actuated, after which they are electrostatically addressed and held open.…”

Section: Design and Function Of The Microshutter Assemblymentioning

confidence: 99%

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Cryogenic photogrammetry and radiometry for the James Webb Space Telescope microshutters

Chambers

Morey²,

Zukowski³

et al. 2012

SPIE Proceedings

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The James Webb Space Telescope (JWST) relies on several innovations to complete its five year mission. One vital technology is microshutters, the programmable field selectors that enable the Near Infrared Spectrometer (NIRSpec) to perform multi-object spectroscopy. Mission success depends on acquiring spectra from large numbers of galaxies by positioning shutter slits over faint targets. Precise selection of faint targets requires field selectors that are both high in contrast and stable in position. We have developed test facilities to evaluate microshutter contrast and alignment stability at their 35K operating temperature. These facilities used a novel application of image registration algorithms to obtain non-contact, sub-micron measurements in cryogenic conditions. The cryogenic motion of the shutters was successfully characterized. Optical results also demonstrated that shutter contrast far exceeds the NIRSpec requirements. Our test program has concluded with the delivery of a flight-qualified field selection subsystem to the NIRSpec bench.

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Section: Discussionmentioning

confidence: 99%

Section: Design and Function Of The Microshutter Assemblymentioning

confidence: 99%

Section: Design and Function Of The Microshutter Assemblymentioning

confidence: 99%

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Cryogenic photogrammetry and radiometry for the James Webb Space Telescope microshutters

Chambers

Morey²,

Zukowski³

et al. 2012

SPIE Proceedings

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“…Such an example is the shutters used for the ST-5 MEMS radiator [59,60] and the James Webb Space Telescope [61]. In both of these systems, large MEMS arrays had to be built, assembled, packaged and tested for space.…”

Section: Mems Shuttersmentioning

confidence: 99%

MEMS Packaging Materials

Darrin

Osiander

2011

MEMS Reference Shelf

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This chapter discusses the differences between the heritage microcircuit packaging world and the still evolving MEMS packaging arena. Materials used in the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to traditional microcircuit chips, MEMS often include moving structures along with the need to have contact with the external environment, driving the requirements for packaging such components. Thus, some functions include interaction with the surrounding environment, such as pressure sensors. This imposes new requisites on packaging, since in regular microelectronics the chip must be protected completely from any impact from the environment. Packaging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstrating novel packaging/material solutions. MEMS Packages and ApplicationsPackaging for MEMs provides for power and signal paths; thermal management; mechanical support; and environmental protection and/or interface protection. MEMS pose numerous packaging challenges that often drive custom solutions by the very nature of their configurations and applications. Commercialized MEMS products such as inkjets and airbag sensors use simple packaging solutions; but devices that involve environmental interface have special requirements that drive

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“…The fabrication of the magnetic and electrostatic elements has also been integrated in mechanical shutter array processing and will be described in section 3.2. Deep Reactive Ion Etching (DRIE) is a critical processing step in the fabrication of microshutter arrays, the control of DRIE processing for shutter arrays has been discussed in a previous paper 8 .…”

Section: Fabrication Of Microshutter Arraysmentioning

confidence: 99%

<title>Magnetically actuated microshutter arrays</title>

Mott

Aslam²,

Blumenstock³

et al. 2001

SPIE Proceedings

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Two-dimensional microshutter arrays are being developed at NASA Goddard Space Flight Center (GSFC) for the Next Generation Space Telescope (NGST) for use in the near-infrared region. Functioning as focal plane object selection devices, the microshutter arrays are 2-D programmable masks with high efficiency and high contrast. The NGST environment requires cryogenic operation at 45 K. Arrays are close-packed silicon nitride membranes with a unit cell size of 100x100 micrometer. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with minimized mechanical stress concentration. The mechanical shutter arrays are fabricated with MEMS technologies. The processing includes a RIE front-etch to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, and a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form frames and to relieve the shutters from the silicon substrate. A layer of magnetic material is deposited onto each shutter. Onto the side-wall of the support structure a metal layer is deposited that acts as a vertical hold electrode. Shutters are rotated into the support structure by means of an external magnet that is swept across the shutter array for opening. Addressing is performed through a scheme using row and column address lines on each chip and external addressing electronics.

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<title>Fabrication of microshutter arrays for space application</title>

Cited by 10 publications

References 2 publications

Cryogenic photogrammetry and radiometry for the James Webb Space Telescope microshutters

Cryogenic photogrammetry and radiometry for the James Webb Space Telescope microshutters

MEMS Packaging Materials

<title>Magnetically actuated microshutter arrays</title>

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