Configurable processors are becoming increasingly popular for modern embedded systems (especially for the field-programmable system-on-a-chip). While steady progress has been made in the tools and methodologies of automatic instruction set extension for configurable processors, the limited data bandwidth available in the core processor (e.g., the number of simultaneous accesses to the register file) becomes a potential performance bottleneck. In this paper we first present a quantitative analysis of the data bandwidth limitation in configurable processors, and then propose a novel low-cost architectural extension and associated compilation techniques to address the problem. The application of our approach results in a promising performance improvement.
Conventionally, microarchitecture designs are mainly guided by the maximum throughput (measured as IPC) and fail to evaluate the impact of architectural decisions on the physical design, and in particular, the impact on the interconnects. In this paper, we propose MEVA, a system to consider both IPC and cycle time in the design space search for a given microarchitectural design. MEVA can consider a variety of user-specified architectural alternatives that trade IPC and cycle time in the design, and performs accurate floorplanning and simulation to fully evaluate each alternative. The resulting solution will maximize the benefit from both IPC and cycle time to provide a better solution than a design space exploration based simply on IPC or cycle time alone. For a sample architectural design, we are able to search a space of 32 architectural configurations with physical planning in less than 2 hours to find a processor configuration that, in terms of BIPS, outperforms the configuration with the best IPC performance by 14%, and the configuration with the fastest clock by 27%. This initial exploration only considers the boundary cases of a much larger design space, but still features substantial IPC and cycle time variation.
-Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact on overall system performance is still poorly understood due to the lack of tools and systematic flows to evaluate 3D microarchitectural designs. The contribution of this paper is the development of MEVA-3D, an automated physical design and architecture performance estimation flow for 3D architectural evaluation which includes 3D floorplanning, routing, interconnect pipelining and automated thermal via insertion, and associated die size, performance, and thermal modeling capabilities. We apply this flow to a simple, out-of-order superscalar microprocessor to evaluate the performance and thermal behavior in 2D and 3D designs, and demonstrate the value of MEVA-3D in providing quantitative evaluation results to guide 3D architecture designs. In particular, we show that it is feasible to manage thermal challenges with a combination of thermal vias and double-sided heat sinks, and report modest system performance gains in 3D designs for these simple test examples.
We study the problem of performing buffer insertion in the context of a given layout. In a practical situation, there are restrictions on where buffers may be inserted; for instance, it may be possible to route wires over a preplaced macro cell, but may not be possible to insert buffers in that region. As a result, it is desirable to perform route planning and buffer insertion simultaneously. Furthermore it is necessary that such an algorithm be aware of the trade-off between cost (e.g., total capacitance) and delay. In this context we propose the delay reduction to cost ratio (DRCR) problem and present a fast algorithm for the same. Solutions identified by the algorithm are characterized with respect to the overall cost versus performance trade-off curve. Computational experiments demonstrate the viability of the approach.
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