Abstract. The school of linguistics established by William Diver, known as the Columbia school, is arguably the most radical on today's linguistic scene. Many of the insights that appear as important or interesting ideas in today's functionalist thinking were incorporated by Diver in a coherent, comprehensive theoretical framework even before functionalism emerged as a distinct line of thought. Diver eschewed a-prioristic and purely deductive categorizations and grounded his work on an empirically-motivated distinction between the language-specific and the universal. He offered a penetrating critique of the categories of syntax which showed them to be a flawed basis for analysis of language, and thereby demonstrated a foundational fault in generative grammar. By focusing on naturally occurring discourse data, the Columbia school has been led to a view of grammatical structure as driven by the communicative function of language and by the effect of human behavioral traits such as inference and minimization of effort. This view reveals that a great deal of what had been regarded as "core syntax" or polysemic is in fact monosemic signal-meaning pairing. Columbia-school analyses demonstrate such hypotheses with innovative contextualized and quantitative validation techniques. The same orienting principles yield an explanatory phonology, one that is thoroughly "natural" and grounded in phonetic substance without being merely descriptive. The Columbia-school framework offers an original view of what constitutes explanation in linguistics.
The use of collapsible (solder) bump interconnects in
pixel detector hybridization has been shown to be very successful. However,
as pixel sizes decrease, the use of non-collapsible metal-to-metal bump
bonding methods is needed to push the interconnect dimensions smaller.
Furthermore, these interconnects are compatible with 3D intgration
technologies which are being considered to increase overall pixel and system
performance. These metal-to-metal bonding structures provide robust
mechanical and electrical connections and allow for a dramatic increase in
pixel density. Of particular interest are Cu-Cu thermocompression bonding
and Cu/Sn-Cu solid-liquid diffusion bonding processes.
Working with Fermilab, RTI undertook a demonstration to show that these bump
structures could be reliably used to interconnect devices designed with 20
micron I/O pitch. Cu and Cu/Sn bump fabrication processes were developed to
provide a well-controlled surface topography necessary for the formation of
low resistance, high yielding, and reliable interconnects. The electrical
resistance and yield has been quantified based on electrical measurements of
daisy chain test structures and the mechanical strength of the bonding has
been quantified through die shear testing. The reliability has been
characterized through studies of the impact of thermal exposure on the
mechanical performance of the bonds. Cross-section SEM analysis, coupled
with high resolution energy dispersive spectroscopy, has provided insight
into the physical and chemical nature of the bonding interfaces and aided in
the evaluation of the long-term stability of the bonds.
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