2019
DOI: 10.1109/jeds.2019.2891204
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TBAL: Tunnel FET-Based Adiabatic Logic for Energy-Efficient, Ultra-Low Voltage IoT Applications

Abstract: The work of J.-S. Liu and M. B. Clavel was supported in part by the National Science Foundation under Grant ECCS-1507950. ABSTRACT A novel, tunnel field-effect transistor (TFET)-based adiabatic logic (TBAL) circuit topology has been proposed, evaluated and benchmarked with several device architectures (planar MOSFET, FinFET, and TFET) and AL implementations (efficient charge recovery logic, 2N-2N2P, positive feedback adiabatic logic) operating in the ultra-low voltage (0.3 V ≥ V DD ≤ 0.6 V) regime. By incorpor… Show more

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Cited by 20 publications
(10 citation statements)
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“…Among several proposed TFETs, III-V TFETs appear more promising because of higher ON current [20][21][22]. In III-V TFETs, InAs homo-junction and GaSb-InAs hetero-junction TFETs exhibit superior performance [31,32].…”
Section: Device Descriptionmentioning
confidence: 99%
See 1 more Smart Citation
“…Among several proposed TFETs, III-V TFETs appear more promising because of higher ON current [20][21][22]. In III-V TFETs, InAs homo-junction and GaSb-InAs hetero-junction TFETs exhibit superior performance [31,32].…”
Section: Device Descriptionmentioning
confidence: 99%
“…Among several post‐CMOS devices, TFETs have emerged as a promising device candidate for future low energy electronic circuit design [20, 21]. TFET with its band‐to‐band tunnelling mechanism achieves a high I ON / I OFF ratio and steep subthreshold swing (SS) (<60 mV/dec) at lower supply voltages [22, 23]. In the recent experimental demonstration, III–V heterojunction TFET achieved 92 µA/µm ON current with 48 mV SS at a supply voltage of 0.5 V [24].…”
Section: Introductionmentioning
confidence: 99%
“…The disadvantage of higher energy and power dissipation is that the circuits require more expensive packaging and expansive cooling technology which decreases reliability also increases cost. As the level of clock frequency and on-chip integration will continue to grow as per the demands of faster computing, the energy and power dissipation of these high performance circuits is a perilous design issue [2]. To achieve Tera Instructions per seconds (TIPS) high end microprocessor employ billions of transistor on chip at clock rates over 30 GHz, with this rate of speed power dissipation of circuit is projected to extend to thousands of watts.…”
Section: Introductionmentioning
confidence: 99%
“…Considering one full cycle of operation from VDD to GND and from GND to VDD, the process of charging the capacitor draws energy from the power supply which is equal to C . (VDD ) 2 . Half power is stored in capacitor while half is dissipated in pMOS, during operation ground to VDD, the capacitance is discharged and energy is dissipated in nMOS.…”
Section: Introductionmentioning
confidence: 99%
“…The continuous reduction in device size leads to exponential increase in the leakage power due to Short Channel Effects. At the device level several alternative structures like CNTFET [9], FinFET and TFET [10] are proposed in place of conventional MOSFET. The use of FinFET as an alternative to CMOS further improves the energy recovery of the adiabatic logic.…”
Section: Introductionmentioning
confidence: 99%