Surface stress distribution in diamond crystals in diamond–silicon carbide composites

Wieligor, Monika; Żerda, T. W.

doi:10.1016/j.diamond.2007.10.035

Cited by 21 publications

(8 citation statements)

References 31 publications

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“…It was observed that the residual stress varied from compressive to tensile towards the edge of the grain. Similar findings were reported by Wieligor and Zerda [12], where the magnitude of the tensile stresses within a single grain increased towards the edges within a diamond-silicon carbide composite. It was also observed that the stress was dependent on a number of manufacturing and sintering conditions.…”

Section: Introductionsupporting

confidence: 84%

A Raman spectroscopy investigation into the influence of thermal treatments on the residual stress of polycrystalline diamond

McNamara

Alveen

Damm

et al. 2015

International Journal of Refractory Metals and Hard Materials

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Section: Introductionsupporting

confidence: 84%

A Raman spectroscopy investigation into the influence of thermal treatments on the residual stress of polycrystalline diamond

McNamara

Alveen

Damm

et al. 2015

International Journal of Refractory Metals and Hard Materials

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“…Raman spectroscopy has been successfully used to evaluate stress in chemical vapor deposited diamond films [6][7][8][9][10]. Despite considerable success of that method in stress characterization in CVD films, little attempt has been made to study stress in diamond composites [11]. In addition, PDC was prepared by diamond and metal catalyst powder-mixing sinter method at HPHT generally.…”

Section: Introductionmentioning

confidence: 99%

HPHT preparation and Micro-Raman characterization of polycrystalline diamond compact with low residual stress

Jia

Guo

et al. 2010

Sci. China Phys. Mech. Astron.

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High quality grown polycrystalline diamond compact (PDC) with low residual stress was prepared using the infiltration method with nickel based alloys as the solvent under high temperature and high pressure (HPHT). Scanning electron microscopy (SEM) was used to observe the micro morphology of the diamond layer and the diamond/WC substrate interface. It was found that dense and interlaced microstructure with diamond-diamond (D-D) direct bonding formed in the diamond layer of PDC. Micro-Raman spectroscopy was used to measure the Raman shift of diamonds in the polycrystalline diamond (PCD) layer and the residual stress was calculated based on the Raman shift of diamonds. Experimental results show that the residual stress of PCD layer is compressive stress, and the range of the residual stress is from 0.075 to 0.250 GPa in the whole PCD layer, much lower than that of other reports (up to 1.400 GPa). Moreover, the distribution of the residual stress from the diamond surface layer to the inner cross-section is homogeneous.

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“…However, in order to fully understand the features of PDC during use, consideration of the residual stress, which is inherent to the sintering process, is also necessary. Many studies on the effects of residual stress in PDC have been reported, including the large mismatch in coefficients of thermal expansion between diamond and solvent metals [2,3], the thickness of the diamond layer [4], the sintering process parameters, thermal treatments, and bonding [5], the sintering temperature, pressure, and the crystal size in diamond-silicon carbide composites [6]. But no attempt has been made to study the residual stress in diamond-WC composites sintered by using different crystal size of diamonds.…”

Section: Introductionmentioning

confidence: 99%

Effects of initial crystal size of diamond powder on surface residual stress and morphology in polycrystalline diamond (PCD) layer

Jia

et al. 2010

Sci. China Phys. Mech. Astron.

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Polycrystalline diamond compacts (PDC) were synthesized using diamond powder of average crystal size 3-20 μm by the Ni 70 Mn 25 Co 5 alloy infiltration technique at high temperature and high pressure (HPHT). The surface residual stress of polycrystalline diamond (PCD) layer was measured using micro-Raman spectroscopy with hydrostatic stress model and X-ray diffraction (XRD). Measurements of the stress levels of PCDs show that the residual compressive stresses range from 0.12 to 0.22 GPa, which increase with the crystal size of diamond. Scanning electron microscopy (SEM) was used to observe the morphology of initial diamond grains and PCD cross-section. The results indicate that PCD has a dense and interlaced microstructure with diamond-diamond (D-D) direct bonding. And the smaller the crystal size of diamond, the better the growth of diamond direct bonding and the smaller the binder metal between diamond boundaries will be.HPHT, polycrystalline diamond (PCD), crystal size, residual stress, morphology

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Surface stress distribution in diamond crystals in diamond–silicon carbide composites

Cited by 21 publications

References 31 publications

A Raman spectroscopy investigation into the influence of thermal treatments on the residual stress of polycrystalline diamond

A Raman spectroscopy investigation into the influence of thermal treatments on the residual stress of polycrystalline diamond

HPHT preparation and Micro-Raman characterization of polycrystalline diamond compact with low residual stress

Effects of initial crystal size of diamond powder on surface residual stress and morphology in polycrystalline diamond (PCD) layer

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