2022 IEEE International Symposium on Smart Electronic Systems (iSES) 2022
DOI: 10.1109/ises54909.2022.00068
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Performance Analysis of Dual Material Graded Channel Cylindrical Gate All Around (DMGC CGAA) FET with Source/Drain Underlap

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Cited by 5 publications
(3 citation statements)
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“…The gate near the source end is known as control gate and gate near drain end is referred as screen gate. Moreover, the DM gate generates a step like potential in the channel region, thereby the electric field increases at interface of gate metals resulting in increase of drain current [19,20]. For a traditional MOSFET, the electric field is weak closer to the source side and increases dramatically as it approaches the drain.…”
Section: Introductionmentioning
confidence: 99%
“…The gate near the source end is known as control gate and gate near drain end is referred as screen gate. Moreover, the DM gate generates a step like potential in the channel region, thereby the electric field increases at interface of gate metals resulting in increase of drain current [19,20]. For a traditional MOSFET, the electric field is weak closer to the source side and increases dramatically as it approaches the drain.…”
Section: Introductionmentioning
confidence: 99%
“…There are different methods like material, gate and channel engineering to enhance the efficiency of the CGAA FET. 5 In gate engineering, a metal gate with two different work functions are utilized having lower and higher work functions at drain and source side respectively, whereas in channel engineering, two different doping concentrations, source side with higher doping concentration and drain side with lower doping concentration 6 is used. Due to dual material gate, development of the step potential occurs in the channel that leads to enhancement of carrier transport and thereby suppresses the hot carrier effect.…”
mentioning
confidence: 99%
“…Adding sufficient underlap in the FinFET structure can limit S/D junction creation to the underlap portion and increase SCE susceptibility. 13,14 The analog performance of the device is mainly influenced by the gate electrostatics and reducing the oxide thickness, formation of thin and tall fins, and controlling the doping profiles are vital aspects of performance enhancements at nano-scale regions. 15,16 Nevertheless, in a fabrication point of view, creating such thin and tall fins for enhanced drive currents and improved SCEs presents several difficulties.…”
mentioning
confidence: 99%