Optics in Computing: From Photonic Network-on-Chip to Chip-to-Chip Interconnects and Disintegrated Architectures

Alexoudi, Theoni; Terzenidis, Nikos; Pitris, Stelios; Moralis-Pegios, Miltiadis; Maniotis, Pavlos; Vagionas, Christos; Mitsolidou, Charoula; Mourgias-Alexandris, George; Kanellos, George T.; Miliou, Amalia; Vyrsokinos, K.; Pleros, Nikos

doi:10.1109/jlt.2018.2875995

Cited by 93 publications

(40 citation statements)

References 141 publications

(124 reference statements)

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“…Connecting multiple servers, memory, and computing resources, optical interconnects at terabit/s is an enabling technology for the next-generation data centers [333]. Within integrated photonics and computing architectures, important challenges remain regarding photonic network-on-chip and chip-to-chip architectures [334]. However, significant flexibility is offered by photonics.…”

Section: Nanosystems and Nanoscience: From Edge Sensing To Edge Comentioning

confidence: 99%

Nanosystems, Edge Computing, and the Next Generation Computing Systems

Passian

Imam

2019

Sensors

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It is widely recognized that nanoscience and nanotechnology and their subfields, such as nanophotonics, nanoelectronics, and nanomechanics, have had a tremendous impact on recent advances in sensing, imaging, and communication, with notable developments, including novel transistors and processor architectures. For example, in addition to being supremely fast, optical and photonic components and devices are capable of operating across multiple orders of magnitude length, power, and spectral scales, encompassing the range from macroscopic device sizes and kW energies to atomic domains and single-photon energies. The extreme versatility of the associated electromagnetic phenomena and applications, both classical and quantum, are therefore highly appealing to the rapidly evolving computing and communication realms, where innovations in both hardware and software are necessary to meet the growing speed and memory requirements. Development of all-optical components, photonic chips, interconnects, and processors will bring the speed of light, photon coherence properties, field confinement and enhancement, information-carrying capacity, and the broad spectrum of light into the high-performance computing, the internet of things, and industries related to cloud, fog, and recently edge computing. Conversely, owing to their extraordinary properties, 0D, 1D, and 2D materials are being explored as a physical basis for the next generation of logic components and processors. Carbon nanotubes, for example, have been recently used to create a new processor beyond proof of principle. These developments, in conjunction with neuromorphic and quantum computing, are envisioned to maintain the growth of computing power beyond the projected plateau for silicon technology. We survey the qualitative figures of merit of technologies of current interest for the next generation computing with an emphasis on edge computing.

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Section: Nanosystems and Nanoscience: From Edge Sensing To Edge Comentioning

confidence: 99%

Nanosystems, Edge Computing, and the Next Generation Computing Systems

Passian

Imam

2019

Sensors

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“…These market needs illustrate current demand for high-performance computing technology that can enable high-volume and high-speed data transfer in computer networks. Recent work, which demonstrated 256 × 256 optical packet switching using eight 40 Gbit/s transceivers, has confirmed that integrated photonic devices have become a key technology for moving large volumes of data in computer networks [3]. Photonic routing technology is being used in data centres as standard rackmount optical backplane systems with an aggregated data rate of 50 Tbit/s using 25 Gbit/s optical transceivers [4].…”

Section: Introductionmentioning

confidence: 99%

Hybrid External Cavity Laser with an Amorphous Silicon-Based Photonic Crystal Cavity Mirror

et al. 2019

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The authors present results on the performance of a hybrid external cavity photonic crystal laser-comprising semiconductor optical amplifier, and a 2D photonic crystal cavity fabricated in low-temperature amorphous silicon. The authors demonstrate that lithographic control over amorphous silicon photonic crystal cavity-resonant wavelengths is possible, and that single-mode lasing at optical telecommunications wavelengths is possible on an amorphous silicon platform.

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“…The dominance, however, of the O-band spectral window in the high-speed DC interconnect segment, has shifted research efforts towards O-band Txs [6]- [11], with ,higher than 25 Gb/s, demonstrations focusing either on single-lane transmitter layouts [6]- [9] or on multi-channel setups [10]. All of them have been, however, implemented as standalone photonic chips, without being yet incorporated into photonic/electronic co-packaged subassemblies.…”

Section: Introductionmentioning

confidence: 99%

“…More specifically, travelling wave Mach Zehnder modulator (MZM) arrays have been recently shown to perform at up to 400G aggregate date rates [10] when operating as standalone Si-Pho chips, requiring additional effort towards bringing them into a Tx subassembly that can reliably ensure the inpackage high-frequency electronics for successfully driving the MZM optics. On the other hand, Si-based ring modulator (RM) counterparts are well-known to offer significant footprint and energy consumption benefits compared to MZM-based arrangements [6]- [9], but these have been only recently validated in O-band Tx subassemblies employing just a single channel layout at >=50 Gb/s operation [8], [12]. O-band Si-based RM multi-channel Tx setups have been just recently demonstrated by us to offer 4×40 Gb/s performance [13], without having been, however, yet incorporated and validated into a fully-fledged electronic/photonic subassembly package.…”

Section: Introductionmentioning

confidence: 99%