2014
DOI: 10.7567/jjap.53.032701
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Optical optimization of InGaN/GaN edge-emitting lasers with reduced AlGaN cladding thickness

Abstract: This paper presents an extensive numerical analysis and experimental testing of a 420 nm InGaN edge-emitting laser grown on plasmonic GaN substrate. Using a simple transfer matrix method, we investigate the influence of waveguide, bottom AlGaN cladding and substrate parameters on the modal gain and the distribution of the mode. Numerical analysis reveals that using plasmonic substrate the thickness of the n-cladding layer can be reduced to as little as 100 nm. In experimental tests, reducing the AlGaN bottom c… Show more

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Cited by 7 publications
(4 citation statements)
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“…To make our results clearer, some other reports about the performance of GaN-based violet LDs are listed in Table II. 9,10,[30][31][32][33][34][35] Table II indicates that there is no LD structure similar to ours (u-GaN UWG=p-AlGaN EBL) in the previously reported lasing GaN-based LDs, and that the threshold current density of our LD II-1 (3.3 kA=cm 2 ) is slightly higher than the lowest value (2.3 kA=cm 2 ). Note that the lowest threshold current density is obtained using a special GaN substrate, i.e., a plasmonic GaN substrate, which is ultra highly doped by hydride vapor phase epitaxy (HVPE) in a high-pressure method.…”
mentioning
confidence: 93%
“…To make our results clearer, some other reports about the performance of GaN-based violet LDs are listed in Table II. 9,10,[30][31][32][33][34][35] Table II indicates that there is no LD structure similar to ours (u-GaN UWG=p-AlGaN EBL) in the previously reported lasing GaN-based LDs, and that the threshold current density of our LD II-1 (3.3 kA=cm 2 ) is slightly higher than the lowest value (2.3 kA=cm 2 ). Note that the lowest threshold current density is obtained using a special GaN substrate, i.e., a plasmonic GaN substrate, which is ultra highly doped by hydride vapor phase epitaxy (HVPE) in a high-pressure method.…”
mentioning
confidence: 93%
“…Many researchers have proposed different electron barrier layer structures to reduce polarization effect and regulate band bending, so as to reduce carrier leakage and improve output power. Compared with the traditional P-AlGaN electron barrier and p-AlGaN EBL-based variants [5][6][7], the quaternary alloy AlInGaN EBL [8][9] has more advantages in suppressing electron leakage and improving hole injection, because it can reduce the valence band barrier height of hole injection while increasing the conduction band barrier height. However, few comparative studies have been conducted on AlInGaN EBL with different Al components, especially when the Al content is higher than 25%.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, in case of nitride material system, there is a significant lattice mismatch between AlN and GaN [8], which strongly limits the thickness attainable in the AlGaN cladding layers. AlGaN layers thicker than the critical thickness tend to crack and the stress introduced in the Al x Ga 1−x N cladding layers results in poor quality material [7,17].…”
Section: Introductionmentioning
confidence: 99%