2018
DOI: 10.7567/jjap.57.070307
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Performance enhancement of the GaN-based laser diode by using an unintentionally doped GaN upper waveguide

Abstract: In our new GaN-based quantum well (QW) laser diode (LD) structure, an unintentionally doped GaN layer (u-GaN) is designed to replace the conventional p-GaN upper waveguide (UWG) and is shifted to locate between the last quantum barrier and the electron-blocking layer. Theoretical calculation demonstrates that the performance of the new LD can be improved significantly by reducing the optical loss and leakage current. Moreover, the experimental results verify that, compared with that of the conventional LD, the… Show more

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Cited by 13 publications
(4 citation statements)
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“…In the simulations, InGaN LDs with GaN barriers were based on Ref [ 16 ], and consist of a 1 μm Si-doped (3 × 10 18 cm −3 ) c-plane GaN substrate, a 1 μm Si-doped (3 × 10 18 cm −3 ) Al 0.08 Ga 0.92 N CL, and a 0.12 μm Si-doped (3 × 10 18 cm −3 ) GaN lower WL. The MQWs consisted of two 2.5 nm In 0.15 Ga 0.85 N QWs and three 14 nm GaN barriers.…”
Section: Structures and Parametersmentioning
confidence: 99%
See 1 more Smart Citation
“…In the simulations, InGaN LDs with GaN barriers were based on Ref [ 16 ], and consist of a 1 μm Si-doped (3 × 10 18 cm −3 ) c-plane GaN substrate, a 1 μm Si-doped (3 × 10 18 cm −3 ) Al 0.08 Ga 0.92 N CL, and a 0.12 μm Si-doped (3 × 10 18 cm −3 ) GaN lower WL. The MQWs consisted of two 2.5 nm In 0.15 Ga 0.85 N QWs and three 14 nm GaN barriers.…”
Section: Structures and Parametersmentioning
confidence: 99%
“…The optoelectronic properties and device performance of these LDs are numerically compared with those with GaN and InGaN barriers. The simulations are performed with LASTIP software [ 15 ], which is frequently used to predict the characteristics of GaN-based LDs [ 16 , 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%
“…The traditional InGaN LDs with GaN QBs is based on those described in [28]; they comprise a 1 µm-thick n-GaN (3 × 10 18 cm −3 ) substrate, a 1 µm-thick n-Al 0.08 Ga 0.92 N (3 × 10 18 cm −3 ) cladding layer, a 120 nm-thick n-GaN (5 × 10 17 cm −3 ) waveguide layer, and two InGaN/GaN MQWs with undoped In 0.15 Ga 0.85 N QWs (2.5 nm) separated by undoped GaN QBs (14 nm). This structure was followed with a 20 nm-thick p-doped Al 0.15 Ga 0.85 N (5 × 10 19 cm −3 ) EBL, a 100 nm-thick p-GaN (2 × 10 19 cm −3 ) waveguide layer, a 1 µm-thick p-Al 0.06 Ga 0.94 N (2 × 10 19 cm −3 ) cladding layer, and a 40 nm-thick p ++ -GaN (1 × 10 20 cm −3 ) ohmic contact layer.…”
Section: Device Structures and Parametersmentioning
confidence: 99%
“…GaN and AlN alloys are good choices for the fabrication of optoelectronics and electronic devices, such as light-emitting diodes, ultraviolet detectors, and high-power and high-frequency electronic devices, due to their excellent material properties [1][2][3][4][5][6][7][8][9] . These applications lead to a huge market, which provides a strong impetus for research.…”
Section: Introductionmentioning
confidence: 99%