2006
DOI: 10.1016/j.mee.2005.10.020
|View full text |Cite
|
Sign up to set email alerts
|

Cubic GaN/AlGaN Schottky-barrier devices on 3C-SiC substrates

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
9
0

Year Published

2006
2006
2012
2012

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 9 publications
(10 citation statements)
references
References 9 publications
(9 reference statements)
0
9
0
Order By: Relevance
“…Therefore, GaN and some other compounds have been studied extensively for their applications in short wavelength optical and high-power/temperature devices, such as light emitting diodes (LEDs), laser diodes (LDs), metal-semiconductor (MS) Schottky barrier diodes (SBDs), metal-insulator-semiconductor high-electron-mobility transistors (MISHEMTs). GaN high-electron-mobility transistors (HEMTs) with Schottky/rectifier metal contact have demonstrated excellent highfrequency, high-power, high temperature and recently good microwave-noise characteristics [1][2][3][4][5][6][7][8][9][10]. The performance level of GaN/ AlGaN HEMT devices has increased rapidly over the last few years.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, GaN and some other compounds have been studied extensively for their applications in short wavelength optical and high-power/temperature devices, such as light emitting diodes (LEDs), laser diodes (LDs), metal-semiconductor (MS) Schottky barrier diodes (SBDs), metal-insulator-semiconductor high-electron-mobility transistors (MISHEMTs). GaN high-electron-mobility transistors (HEMTs) with Schottky/rectifier metal contact have demonstrated excellent highfrequency, high-power, high temperature and recently good microwave-noise characteristics [1][2][3][4][5][6][7][8][9][10]. The performance level of GaN/ AlGaN HEMT devices has increased rapidly over the last few years.…”
Section: Introductionmentioning
confidence: 99%
“…Mostly, c-GaN is deposited using the molecular beam epitaxy (MBE) technique due to the lower process temperatures in comparison to metal organic CVD (MOCVD). By depositing under Ga-rich conditions the metastable cubic polytype could be stabilized, whereas the amount of inclusions of the thermodynamically stable hexagonal polytype of GaN (h-GaN) was minimized [31][32][33]. Within this MBE growth regime, functional devices like green light-emitting cubic InGaN/GaN multi-quantum-well structures could be achieved [34].…”
Section: Introductionmentioning
confidence: 99%
“…(001) oriented self supported 3C-SiC substrates have been used for growing cubic GaN based heterostructures [7]. (001) oriented self supported 3C-SiC substrates have been used for growing cubic GaN based heterostructures [7].…”
Section: Introductionmentioning
confidence: 99%