2008
DOI: 10.1557/proc-1068-c04-05
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Growth of AlGaN/GaN HEMTs on 3C-SiC/Si(111) Substrates

Abstract: In this work, we study cubic SiC/Si (111) templates as an alternative for growing GaN on silicon. We first developed the epitaxial growth of 3C-SiC films on 50mm Si(111) substrates using chemical vapor deposition. Then, AlGaN/GaN high electron mobility transistors were grown by molecular beam epitaxy on these templates. Both the structural quality and the behavior of transistors realized on these structures show the feasibility of this approach.

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Cited by 2 publications
(2 citation statements)
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“…Supported by the researches of Wang, L. and Cordier, Y. [6,7], the thickness, surface morphology, off-cut angle, curvature magnitude, and shape of 3C-SiC/Si template will affect the strain relaxation and dislocation density reduction in the GaN layer which grown on the 3C-SiC/Si substrate. The growth temperature has direct effect on the surface, the crystalline quality and the curvature of 3C-SiC films.…”
Section: Introduction *mentioning
confidence: 99%
“…Supported by the researches of Wang, L. and Cordier, Y. [6,7], the thickness, surface morphology, off-cut angle, curvature magnitude, and shape of 3C-SiC/Si template will affect the strain relaxation and dislocation density reduction in the GaN layer which grown on the 3C-SiC/Si substrate. The growth temperature has direct effect on the surface, the crystalline quality and the curvature of 3C-SiC films.…”
Section: Introduction *mentioning
confidence: 99%
“…There are several challenges in reaching this goal [1], firstly the wafers must adhere to strict control on bow and wafer thickness imposed to avoid problems during device processing in a regular CMOS fab. Some of the techniques which are used to compensate the large stress developed during GaN growth on silicon are use of thick silicon wafers, patterned wafers [2], Al 2 O 3on-Si [3] or SiC-on-Si [4] coated wafers which help reduce the thermal/lattice mismatch. In this paper we present techniques which play significant role in satisfying the set specification limits without using techniques which add to the processing steps.…”
Section: Introductionmentioning
confidence: 99%