Femtosecond laser machining has been widely used for fabricating arbitrary 2.5 dimensional (2.5D) structures. However, it suffers from the problems of low fabrication efficiency and high surface roughness when processing hard materials. To solve these problems, we propose a dry‐etching‐assisted femtosecond laser machining (DE‐FsLM) approach in this paper. The fabrication efficiency could be significantly improved for the formation of complicated 2.5D structures, as the power required for the laser modification of materials is lower than that required for laser ablation. Furthermore, the surface roughness defined by the root‐mean‐square improved by an order of magnitude because of the flat interfaces of laser‐modified regions and untreated areas as well as accurate control during the dry‐etching process. As the dry‐etching system is compatible with the IC fabrication process, the DE‐FsLM technology shows great potential for application in the device integration processing industry.
Natural compound eyes provide the inspiration for developing artificial optical devices that feature a large field of view (FOV). However, the imaging ability of artificial compound eyes is generally based on the large number of ommatidia. The lack of a tunable imaging mechanism significantly limits the practical applications of artificial compound eyes, for instance, distinguishing targets at different distances. Herein, we reported zoom compound eyes that enable variable-focus imaging by integrating a deformable poly(dimethylsiloxane) (PDMS) microlens array (MLA) with a microfluidic chamber. The thin and soft PDMS MLA was fabricated by soft lithography using a hard template prepared by a combined technology of femtosecond laser processing and wet etching. As compared with other mechanical machining strategies, our combined technology features high flexibility, efficiency, and uniformity, as well as designable processing capability, since the size, distribution, and arrangement of the ommatidia can be well controlled during femtosecond laser processing. By tuning the volume of water injected into the chamber, the PDMS MLA can deform from a planar structure to a hemispherical shape, evolving into a tunable compound eye of variable FOV up to 180°. More importantly, the tunable chamber can functionalize as the main zoom lens for tunable imaging, which endows the compound eye with the additional capability of distinguishing targets at different distances. Its focal length can be turned from 3.03 mm to infinity with an angular resolution of 3.86 × 10–4 rad. This zoom compound eye combines the advantages of monocular eyes and compound eyes together, holding great promise for developing advanced micro-optical devices that enable large FOV and variable-focus imaging.
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We report fabrication of silica convex microlens arrays with controlled shape, size, and curvature by femtosecond laser direct writing. A backside etching in dye solution was utilized for laser machining high-fidelity control of material removal and real-time surface cleaning from ablation debris. Thermal annealing was applied to reduce surface roughness to 3 nm (rms). The good optical performance of the arrays was confirmed by focusing and imaging tests. Complex 3D micro-optical elements over a footprint of 100 × 100 µ m 2 were ablated within 1 h (required for practical applications). A material removal speed of 120 µ m 3 / s ( 6 × 10 5 n m 3 / p u l s e ) was used, which is more than an order of magnitude higher compared to backside etching using a mask projection method. The method is applicable for fabrication of micro-optical components on transparent hard materials.
Inspired by insect compound eyes (CEs) that feature unique optical schemes for imaging, there has recently been growing interest in developing optoelectronic CE cameras with comparable size and functions. However, considering the mismatch between the complex 3D configuration of CEs and the planar nature of available imaging sensors, it is currently challenging to reach this end. Here, we report a paradigm in miniature optoelectronic integrated CE camera by manufacturing polymer CEs with 19~160 logarithmic profile ommatidia via femtosecond laser two-photon polymerization. In contrast to μ-CEs with spherical ommatidia that suffer from defocusing problems, the as-obtained μ-CEs with logarithmic ommatidia permit direct integration with a commercial CMOS detector, because the depth-of-field and focus range of all the logarithmic ommatidia are significantly increased. The optoelectronic integrated μ-CE camera enables large field-of-view imaging (90°), spatial position identification and sensitive trajectory monitoring of moving targets. Moreover, the miniature μ-CE camera can be integrated with a microfluidic chip and serves as an on-chip camera for real-time microorganisms monitoring. The insect-scale optoelectronic μ-CE camera provides a practical route for integrating well-developed planar imaging sensors with complex micro-optics elements, holding great promise for cutting-edge applications in endoscopy and robot vision.
We report a novel microlens array with different curvature unit lenses (MLADC) fabricated with femtosecond laser direct writing technology. The MLADC consisted of hexagonal hyperboloid unit microlenses, which have different heights and curvatures from others. The unique optical performance of imaging and focusing capability were demonstrated. An object was imaged at different positions from the MLADC by unit lenses, as the ability of adjusting the curvature of the image plane for overall MLADC. In addition, the experiment had a good agreement with simulation results, which was based on the analysis of the finite element method. The novel MLADC will have important applications in improving the performance of optical systems, especially in field curvature correction and real-time three-dimensional imaging.
This work developed a method of femtosecond laser (fs-laser) parallel processing assisted by wet etching to fabricate 3D micro-optical components. A 2D fs-laser spot array with designed spatial distribution was generated by a spatial light modulator. A single-pulse exposure of the entire array was used for parallel processing. By subsequent wet etching, a close-packed hexagonal arrangement, 3D concave microlens array on a curved surface with a radius of approximately 120 μm was fabricated, each unit lens of which has designable spatial distribution. Characterization of imaging was carried out by a microscope and showed a unique imaging property in multi-planes. This method provides a parallel and efficient technique to fabricate 3D micro-optical devices for applications in optofluidics, optical communication, and integrated optics.
Boson Sampling is a computational paradigm representing one of the most viable and pursued approaches to demonstrate the regime of quantum advantage. Recent results have shown significant technological leaps in single-photon generation and detection, leading to progressively larger instances of Boson Sampling experiments in different photonic systems. However, a crucial requirement for a fully-fledged platform solving this problem is the capability of implementing large-scale interferometers, that must simultaneously exhibit low losses, high degree of reconfigurability and the realization of arbitrary transformations. In this work, we move a step forward in this direction by demonstrating the adoption of a compact and reconfigurable 3D-integrated platform for photonic Boson Sampling. We perform 3- and 4-photon experiments by using such platform, showing the possibility of programming the circuit to implement a large number of unitary transformations. These results show that such compact and highly-reconfigurable layout can be scaled up to experiments with larger number of photons and modes, and can provide a viable direction for hybrid computing with photonic processors.
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