2017
DOI: 10.1002/lpor.201600115
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Dry‐etching‐assisted femtosecond laser machining

Abstract: Femtosecond laser machining has been widely used for fabricating arbitrary 2.5 dimensional (2.5D) structures. However, it suffers from the problems of low fabrication efficiency and high surface roughness when processing hard materials. To solve these problems, we propose a dry‐etching‐assisted femtosecond laser machining (DE‐FsLM) approach in this paper. The fabrication efficiency could be significantly improved for the formation of complicated 2.5D structures, as the power required for the laser modification… Show more

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Cited by 80 publications
(43 citation statements)
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“…In 2017, X. Liu et al proposed a dry etching assisted femtosecond laser machining (DE-FsLM) method. Since the power required for the laser-modified material was lower than the power required for laser ablation, the manufacturing efficiency can be improved to form a complicated 2.5D structure [211]. Figure 23 illustrated the use of a femtosecond laser to modify and then perform a dry etch process to fabricate the microstructure.…”
Section: D and 3d Micro/nano Structures By Laser-assisted Processingmentioning
confidence: 99%
“…In 2017, X. Liu et al proposed a dry etching assisted femtosecond laser machining (DE-FsLM) method. Since the power required for the laser-modified material was lower than the power required for laser ablation, the manufacturing efficiency can be improved to form a complicated 2.5D structure [211]. Figure 23 illustrated the use of a femtosecond laser to modify and then perform a dry etch process to fabricate the microstructure.…”
Section: D and 3d Micro/nano Structures By Laser-assisted Processingmentioning
confidence: 99%
“…Taking advantages of well controllability, high precision, wide range of processable materials and compatibility with semiconductor manufacturing of dry etching, Liu et al 97 firstly proposed the dry-etching-assisted femtosecond laser modification technology to process hard materials, which also includes two steps: femtosecond laser modification for pattern definition and subsequent ICP etching for structures developing, as the schematic diagram shown in Fig. 8(a).…”
Section: Dry-etching-assisted Femtosecond Laser Modificationmentioning
confidence: 99%
“…Recently, due to its high precision and three‐dimensional (3D) processing capabilities, the femtosecond laser fabrication has become widely used in the fabrication of complex 3D micro/nanostructures . Annealing and chemical etching after the laser ablation/modification are always necessary to decrease the surface roughness of microstructures fabricated on hard materials . Based on these methods, fused silica glass microlenses and silicon microlenses can be realized with high controllability.…”
Section: Introductionmentioning
confidence: 99%