H-1 MR spectroscopy can be used to image and noninvasively quantify total creatine in human muscle. Its use could improve the understanding of the role of altered creatine metabolism in muscle disease and aid quantification of the response to creatine therapies.
This paper outlines and discusses the new mechanical characterization metrology applied on PCI board. The dynamic responses of PCI board were monitored and characterized using accelerometers and strain gauges. PCI board bend modes were analyzed to differentiate high risk areas through analysis of board strain responses to solder joint crack performance. Key influences, such as thermal/mechanical enabling preload masses and profiled shock on solder joint crack severity were also conducted to understand the potential SJR performance risk modulators. Commercial simulation software analysis tool was applied to correlate and predict the board’s bend modes; providing key information for product enabling solutions design. With this new characterization and validation concept, a practical stiffener solution for PCI application was designed to improve board SJR performance in its application condition.
This paper discusses the SJR performance and characteristic study for IHS package technology. Limited industry literature for design reference is the key motivator of this IHS base SJR evaluation on various stresses. Both experimental and simulation studies were performed to identify the critical reliability factors impacting the SJR in static compressive, mechanical shock and transient bend stresses. The critical SJR factors on thermo-mechanical fatigue included solder systems, types of preload and board thickness design were investigated. The impacts of ball pitches, board thicknesses and ball attach process in shock loading will be discussed. Furthermore, the sensitivities contributed by ball pitches, board thicknesses and trace orientation design on transient bend were evaluated as well. Beside, the performance trends and failure modes were analyzed to gather better understanding especially on its driving mechanism. As a summary, this paper presents and documents the key influence factors in SJR for electronic package design in IHS configuration.
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