A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

Abstract

This paper outlines and discusses the new mechanical characterization metrology applied on PCI board. The dynamic responses of PCI board were monitored and characterized using accelerometers and strain gauges. PCI board bend modes were analyzed to differentiate high risk areas through analysis of board strain responses to solder joint crack performance. Key influences, such as thermal/mechanical enabling preload masses and profiled shock on solder joint crack severity were also conducted to understand the potential SJR performance risk modulators. Commercial simulation software analysis tool was applied to correlate and predict the board’s bend modes; providing key information for product enabling solutions design. With this new characterization and validation concept, a practical stiffener solution for PCI application was designed to improve board SJR performance in its application condition.

Influence of Package Assembly Process on Solder Joint Reliability - an Application of Component Level Shock Methodology

“…With the implementation of LF system in second level interconnects, the SJR risk for shock become a key concern area and study has been done to compare with leaded solder joint performance [2]. Past extensive research work has only focused on effect of package and system design to package shock robustness [3][4][5], and very little is known about the effect of package assembly processes to package shock performance. Industry needs to face and overcome this big challenge in assembly process to convert to LF compatible process window.…”