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Purpose -To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach -The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained. Findings -Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively. Research limitations/implications -Limited to cases where the correlations for heat transfer coefficients are valid. Practical implications -A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area. Originality/value -A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.

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This paper discusses the SJR performance and characteristic study for IHS package technology. Limited industry literature for design reference is the key motivator of this IHS base SJR evaluation on various stresses. Both experimental and simulation studies were performed to identify the critical reliability factors impacting the SJR in static compressive, mechanical shock and transient bend stresses. The critical SJR factors on thermo-mechanical fatigue included solder systems, types of preload and board thickness design were investigated. The impacts of ball pitches, board thicknesses and ball attach process in shock loading will be discussed. Furthermore, the sensitivities contributed by ball pitches, board thicknesses and trace orientation design on transient bend were evaluated as well. Beside, the performance trends and failure modes were analyzed to gather better understanding especially on its driving mechanism. As a summary, this paper presents and documents the key influence factors in SJR for electronic package design in IHS configuration.