Optimization of fins used in electronic packaging

Abstract

Purpose -To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach -The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained. Findings -Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively. Research limitations/implications -Limited to cases where the correlations for heat transfer coefficients are valid. Practical implications -A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area. Originality/value -A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.

Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach

“…Leong et al (2013) considered RSM to optimize a standard flexible PCB in the flow environments to minimize the stresses induced by fluid structure interactions. Also, RSM and genetic algorithms were used to find the optimal geometries of rectangular and cylindrical fins attached to electronic packages to ensure maximum heat dissipation (Eu Ong et al, 2005). A state-of-the-art review on the multidisciplinary design and statistical optimization methodologies used in electronic packaging can be found in a study by Hadim and Suwa (2008).…”