Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach

Abstract

Purpose This paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis technique. The effects of various geometric parameters, the size and thickness of the printed circuit board and component and solder interconnect dimensions on the fundamental resonant frequency of the assembly and the axial strain of the most critical solder joint were thoroughly investigated. Design/methodology/approach A previously published analytical solution for the problem of electronic assembly vibration was adopted. This solution was modified and used to generate the natural frequency and solder axial strains data for various package geometries. Statistical factorial analysis was used to analyze these data. Findings The results of the present study showed that the reliability of electronic packages under vibration could be significantly enhanced by selecting larger and thicker printed circuit boards and thinner and smaller electrical components. Additionally, taller and thinner solders might also produce better reliability behavior. Originality/value The results of this investigation can be very useful in the design process of electronic products in mechanical vibration environments.

Drop and impact reliability investigation of BGA and LGA interconnects

“…It is important to mention here is that this correlation is done for a test board with BGA solders assembled with SAC305 alloy. In fact, previous research works proved that neither the solder configuration nor alloy have a significant contribution on the overall stiffness of the electronic assembly (Gharaibeh et al , 2018a, 2018b; Gharaibeh, 2018a, 2018b, 2019; Standard, 2004a, 2004b; Amagai et al , 2002; Gharaibeh, 2021; Su et al , 2018, 2014; Gharaibeh and Makhlouf, 2019; Gharaibeh and Pitarresi, 2023; Gharaibeh, 2022b). Therefore, no need for further correlation and comparison analysis between FEA and measurements for other types and configurations of the interconnections.…”

“…The findings of this study proved that, in high-cycle fatigue experiments, the LGA package outperforms the ball-based interconnections in both alloy configurations. Other numerical and analytical studies of Gharaibeh and his co-workers suggested that, generally, shorter SAC305-based interconnects have improved fatigue performance, that is, reliability, in harmonic vibration (Gharaibeh et al, 2018b;Gharaibeh, 2018aGharaibeh, , 2018bGharaibeh, , 2019, random vibration (Gharaibeh, 2020; Expression of concern: The publisher of the Soldering & Surface Mount Technology is issuing an Expression of Concern for the following article: Gharaibeh, M.A. and Pitarresi, J.M.…”

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

“…On the other hand, LGA are less likely to be flexed, as they are much shorter. Therefore, they will not have high bending and shearing stresses (Gharaibeh, 2018c; Obaidat et al , 2016; Gharaibeh, 2018b).…”

“…Electronics nowadays come in smaller, thinner and lighter specifications, and they can be found in different applications, for example, computers, laptops and handheld devices. Therefore, extensive experimental (Chen et al , 2008; Su et al , 2018; Su et al , 2014), numerical (Gharaibeh, 2018a; Xia et al , 2017a; Xia et al , 2017b; Gharaibeh, 2018c) and analytical (Obaidat et al , 2016; Gharaibeh, 2018b; Gharaibeh et al , 2017; Gharaibeh et al , 2018) methodologies were developed to study and evaluate the reliability of critical components.…”

Numerical Solution for the Mechanical Bending of Two Elastically Coupled Plates Problem

“…The first introduction of the two coupled plates structure was in 2015 where Gharaibeh et al [19] used Ritz method to solve for the free vibration characteristics of the problem and computed the natural frequencies and mode shapes of the coupled plates system. Later, Gharaibeh et al [20][21][22][23] expanded this solution to solve for the forced vibrations of the coupled plates due to harmonic [20,21], transient [22], and random vibrations excitations [23]. In all works, the solution was validated with experiments and thus employed to test the influence of the geometric and material parameters of the structure on solder joints deflections, strains, and stresses.…”