In this paper, we describe the development of a platform‐based SoC of a 32‐bit smart card. The smart card uses a 32‐bit microprocessor for high performance and two cryptographic processors for high security. It supports both contact and contactless interfaces, which comply with ISO/IEC 7816 and 14496 Type B. It has a Java Card OS to support multiple applications. We modeled smart card readers with a foreign language interface for efficient verification of the smart card SoC. The SoC was implemented using 0.25 µm technology. To reduce the power consumption of the smart card SoC, we applied power optimization techniques, including clock gating. Experimental results show that the power consumption of the RSA and ECC cryptographic processors can be reduced by 32% and 62%, respectively, without increasing the area.
An application specific processor for an H.264 decoder with a configurable embedded processor is designed in this research. The motion compensation, inverse integer transform, inverse quantization, and entropy decoding algorithm of H.264 decoder software are optimized. We improved the performance of the processor with instruction‐level hardware optimization, which is tailored to configurable embedded processor architecture. The optimized instructions for video processing can be used in other video compression standards such as MPEG 1, 2, and 4. A significant performance improvement is achieved with high flexibility. Experimental results show that we could achieve 300% performance for the H.264 baseline profile level 2 decoder.
Ranging from circuit-level characterization to designing a platform architecture, developing a design automation tool, and fabricating a System on Chip (SoC), this article deals with the entire development process for ultralow-power (ULP) SoCs for Internet-of-Things (IoT) end nodes. More precisely, this article first focuses on the unique characteristics of the ULP circuits, the temperature effect inversion (TEI), i.e., the delay of the ULP circuits decreases with increasing temperature. Existing TEI-aware low-power (TEI-LP) techniques have incredible potential to further reduce the power consumption of conventional ULP SoCs, but there is a critical limitation to be widely adopted in real SoCs. To address this limitation and realize the ULP SoCs that can fully benefit from the TEI-LP techniques, this article proposes a new TEI-inspired SoC platform (TIP) architecture. On top of that, taking into account that the highly complex, time consuming, and labor-intensive development process of these ULP SoCs may hinder their widespread use for IoT end nodes, this article presents a new electronic design automation tool to accelerate ULP SoC development, RISC-V express (RVX). Finally, by using the RVX, this article introduces a TIP prototyping chip fabricated in 28-nm FD-SOI technology. This chip demonstrates that power savings of up to 35% can be achieved by lowering the supply voltage from 0.54 to 0.48 V at 25 • C and 0.44 V at 80 • C while continuing to operate at a target 50-MHz clock frequency.
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