Hybrid and monolithic thinned backside illuminated CMOS imagers operating at full depletion at low substrate voltages were developed. The combination of a 50 µm EPI layer with varying doping concentration and trenches to reduce crosstalk is unique. All thin wafer processing is performed on 200 mm wafers using a specially developed temporary carrier process. As a result, working imagers exhibiting high pixel yield, high quantum efficiency and low dark current are demonstrated.
In this paper we report on our approach on integrating c-Si PV into lightweight structures, in particular towards vehicle integration. To this end we want to get rid of the (bulk weight of the) glass but seek a suitable replacement in terms of mechanical stability. First we elaborate on the most basic standards and norms that VIPV products should relate to in terms of (thermo-)mechanical testing. Then, for the experimental part, 2 concepts are investigated. In a first approach, we reinforced the encapsulant with glass fibre material, while in a second one we applied a dedicated glass-fibre-reinforced sheet as a replacement of the backsheet. In both cases we stay as close as possible to using commercially available material. For each approach we elaborate the testing that has been carried out: thermal cycling, vibrations, mechanical shock and hail impact. On a final note, we point out some initial damp heat testing results, that are a particular challenge for light-weight modules without glass.
Back‐contact solar cells are an interesting technology with advantages over traditional two‐sided cells. A lack of standardized and low‐cost interconnection methods inhibits their market penetration. In an attempt to overcome this obstacle, this work introduces an interconnection technology, based on a fabric of encapsulant with incorporated metal ribbons. The encapsulant is tailored for this application by adding glass fibres to a thermoplastic polyolefin. For this tailored encapsulant, characterization experiments were conducted and results on viscosity and coefficient of thermal expansion are shown. Initial reliability testing on sample‐size modules with high‐efficiency interdigitated back‐contact (IBC) cells shows promising results, passing up to four times the IEC 61215 standard for thermal cycling.
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