2017 IEEE 44th Photovoltaic Specialist Conference (PVSC) 2017
DOI: 10.1109/pvsc.2017.8366849
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Multi-wire interconnection technologies weaving the way for back contact and bifacial PV modules

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Cited by 2 publications
(3 citation statements)
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“…Such an approach allows the highest potential of addressing performance and cost requirements in an initial stage. To this end, we consider conventional tabbing and stringing of commercial homojunction cells, based on standard SnPb soldering, both for the older 3BB BSF cells and the more recent 9BB PERC and TOPCON half-cells and multi-wire interconnection [1][2][3][4], as well as shingling of heterojunction cells [5,6]. These last concepts of multi-wire and shingling are, apart from providing an increased performance, both also very much interesting from an aesthetics point-of-view, as they provide a more homogeneous aspect to the active area of PV modules.…”
Section: Experimental Module Fabricationmentioning
confidence: 99%
“…Such an approach allows the highest potential of addressing performance and cost requirements in an initial stage. To this end, we consider conventional tabbing and stringing of commercial homojunction cells, based on standard SnPb soldering, both for the older 3BB BSF cells and the more recent 9BB PERC and TOPCON half-cells and multi-wire interconnection [1][2][3][4], as well as shingling of heterojunction cells [5,6]. These last concepts of multi-wire and shingling are, apart from providing an increased performance, both also very much interesting from an aesthetics point-of-view, as they provide a more homogeneous aspect to the active area of PV modules.…”
Section: Experimental Module Fabricationmentioning
confidence: 99%
“…Imec's woven interconnection attempts to overcome this, by using an interconnection foil of copper wires held in place by interwoven, continuous glass fibres 12 . This brings the advantage of reduced silver consumption and an increased power yield from the multi‐wire interconnection technologies for two‐side contacted cells 13 . Cell to wire interconnection is provided by dispensed solder paste, whereas short‐circuiting between different wires is prevented by using the glass fibres as spacers.…”
Section: Background On Back‐contact Interconnectionmentioning
confidence: 99%
“…A more in‐depth analysis of the progress and knowledge of the back‐contact interconnection technology is beyond the scope of this paper but can be found in previous publications. 12,13 …”
Section: Background On Back‐contact Interconnectionmentioning
confidence: 99%