2008
DOI: 10.1016/j.nima.2008.03.099
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The RELAXd project: Development of four-side tilable photon-counting imagers

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Cited by 38 publications
(29 citation statements)
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“…There are many designs of small prototype integrated circuits, even in very advanced nano-CMOS technologies or 3D technologies [9][10][11][12]. However, for practical applications, large area integrated circuits play a crucial role, especially if they allow to build large area detector systems [5,13,14]. In such kinds of integrated circuits, critical parameters are a good uniformity of analog parameters for all channels, a low noise performance with a small power consumption per single pixel, no additional crosstalk, high count rate, etc.…”
Section: Nuclear Instruments and Methods Inmentioning
confidence: 99%
“…There are many designs of small prototype integrated circuits, even in very advanced nano-CMOS technologies or 3D technologies [9][10][11][12]. However, for practical applications, large area integrated circuits play a crucial role, especially if they allow to build large area detector systems [5,13,14]. In such kinds of integrated circuits, critical parameters are a good uniformity of analog parameters for all channels, a low noise performance with a small power consumption per single pixel, no additional crosstalk, high count rate, etc.…”
Section: Nuclear Instruments and Methods Inmentioning
confidence: 99%
“…Thanks to this technology, the cost and the form factor of components could be decreased and the performance of the global system could be enhanced. In the field of radiation imaging detectors the advantages of 3D Integration come from reduced inter chip dead area even on large surfaces and from improved detector construction yield resulting from the use of single chip 4-side buttable tiles [2]. For many years, numerous R&D centres and companies have put a lot of effort into developing 3D integration technologies and today, some mature technologies are ready for prototyping and production [3].…”
mentioning
confidence: 99%
“…In initial tests on single anode devices (not imaging chips) we observed good results with both Ar−CH 4 and Ne−CH 4 mixtures. ese devices are inherently spark proof.…”
Section: Gas Choicementioning
confidence: 90%
“…is requires connections from the front side to the backside of the detector substrate as well as many other advanced technologies, for instance related to edge termination of the detector bias voltage. Examples of such a tiled detector can be found in [4].…”
Section: Solid-state Photon Detectorsmentioning
confidence: 99%
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