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In this study, the authors have proposed a Write Assist Low Power 11T (WALP11T) SRAM cell. To analyse its performance in terms of major design metrics, the proposed cell has been compared with contemporary SRAMs like the Fully Differential 8T (FD8T), Single-Ended Disturb Free 9T (SEDF9T), Bit-interleaving architecture supporting 11T (BI11T), Selfrefreshing Logic-based 12T (WWL12T) and Differential 12T (D12T) cells. The proposed cell exhibits significantly shorter read/ write delay when compared to most comparison cells. It shows considerably higher read stability and write ability than that of FD8T and SEDF9T/D12T/WWL12T, respectively. Moreover, WALP11T dissipates significantly lower leakage power in comparison to the majority of comparison cells and exhibits 2.21 × /1.18 × lower read power delay product (R PDP) than that of BI11T/D12T and 5.12 × /1.39 × /1.09 × lower write power delay product (W PDP) than that of BI11T/WWL12T/D12T. The proposed cell consumes considerably lower area than WWL12T/D12T and shows highly reliable operation when subjected to the harsh process, voltage and temperature variations at both Slow NMOS-Fast PMOS and Fast NMOS-Slow PMOS corners. For all these improvements, WALP11T shows longer read/write delay than FD8T, higher leakage power and power delay product than BI11T and FD8T/SEDF9T, respectively, at V DD = 0.3 V.

A 3 CNFETs and 2 memristors-based half-select disturbance free 3T2R resistive RAM (RRAM) cell is proposed in this paper. While the two memristors act as the nonvolatile memory elements, CNFETs are employed as high-performance switches. The proposed cell is capable of implementing bit-interleaving architecture and various error correction coding (ECC) schemes can be applied to mitigate soft-errors. The 3T2R cell has been compared with the standard 6T SRAM (S6T) and 2T2R cells. At a supply voltage of 2 V, the 3T2R cell exhibits 7.24× shorter write delay (T WA ) and 2.89× lower variability in T WA than that of 2T2R. Moreover, it exhibits 5.08 × /4.33× lower variability in T RA and 1.46 × 10 7 × /2.07× lower hold power (H PWR ) dissipation than that of S6T/ 2T2R at V DD = 2 V. In addition, it exhibits tolerance to variations in V th of memristor while being immune to resistance-state drift and random telegraph noise (RTN)-induced instabilities during the read operation. The vastly superior characteristics of CNFET devices over MOSFETs, in combination with memristor technology, leads to such appreciable improvement in design metrics of the proposed design.

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