Coronary artery disease (CAD) remains the leading cause of mortality among cardiovascular diseases, responsible for 16% of the world’s total deaths. According to a statistical report published in 2020, the global prevalence of CAD was estimated at 1655 per 100,000 people and is predicted to exceed 1845 by 2030. Annually, in the United States, CAD accounts for approximately 610,000 deaths and costs more than 200 billion dollars for healthcare services. Most patients with CAD need to be treated over long periods with a combination of drugs. Therefore, the inappropriate use of drugs, or drug-related problems (DRPs), can lead to many consequences that affect these patients’ health, including decreased quality of life, increased hospitalization rates, prolonged hospital stays, increased overall health care costs, and even increased risk of morbidity and mortality. DRPs are common in CAD patients, with a prevalence of over 60%. DRPs must therefore be noticed and recognized by healthcare professionals. This chapter describes common types and determinants of DRPs in CAD patients and recommends interventions to limit their prevalence.

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Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder. Mechanical coupling of the chip and the laminate is done via underfill encapsulant materials. As the chip size increases, the thermal mismatch between silicon and its organic carrier becomes greater. Adhesion becomes an important factor since the C4 joints fail quickly if delamination of the underfill from either chip or the solder mask interface occurs. Newly developed underfills have been studied to examine their properties, including interfacial adhesion strength, flow characteristics, void formation and cure kinetics. This paper will describe basic investigations into the properties of these underfills and also how these properties related to the overall development process.In addition, experiments were performed to determine the effects on adhesion degradation of flip chip assembly processes and materials such as IR reflow profile, flux quantity and residues. Surface treatment of both the chip and the laminate prior to encapsulation were studied to enhance underfill adhesion. Accelerated thermal cycling and highly accelerated stress testing (HAST) were conducted to compare various underfill properties and reliability responses.Index Terms-Chip carrier, electronic package, fracture toughness, interfacial delamination, underfill adhesive.

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