Underfill: The Enabling Technology for Flip-Chip Packaging

Buchwalter, Stephen L.; Edwards, Maurice E.; Gamota, Daniel; Gaynes, Michael; Tran, S.

doi:10.1007/978-1-4615-1389-6_12

Cited by 3 publications

(1 citation statement)

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“…The underfill in Regatta serves primarily to provide environmental protection of the C4s, as well as providing overall mechanical rigidity of the structure and electrical isolation. Table 5 shows several typical properties of underfill materials [18]. Key parameters of underfills are low viscosity, high glass transition temperature (T g ), high modulus, moderately low thermal expansion coefficient, inorganic filler of proper particle size that is adequately dispersed in the underfill resin, and superior adhesion to the chip and substrate surfaces.…”

Section: Underfill Processmentioning

confidence: 99%

An advanced multichip module (MCM) for high-performance UNIX servers

et al. 2002

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In 2001, IBM delivered to the marketplace a high-performance UNIX ® -class eServer based on a four-chip multichip module (MCM) code named Regatta. This MCM supports four POWER4 chips, each with 170 million transistors, which utilize the IBM advanced copper back-end interconnect technology. Each chip is attached to the MCM through 7018 flip-chip solder connections. The MCM, fabricated using the IBM high-performance glass-ceramic technology, features 1.7 million internal copper vias and high-density topsurface contact pad arrays with 100-m pads on 200-m centers. Interconnections between chips on the MCM and interconnections to the board for power distribution and MCM-to-MCM communication are provided by 190 meters of co-sintered copper wiring. Additionally, the 5100 off-module connections on the bottom side of the MCM are fabricated at a 1-mm pitch and connected to the board through the use of a novel land grid array technology, thus enabling a compact 85-mm ؋ 85-mm module footprint that enables 8-to 32-way systems with processors operating at 1.1 GHz or 1.3 GHz. The MCM also incorporates advanced thermal solutions that enable 156 W of cooling per chip. This paper presents a detailed overview of the fabrication, assembly, testing, and reliability qualification of this advanced MCM technology.

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Section: Underfill Processmentioning

confidence: 99%