Adhesion issues in flip-chip on organic modules

Tran, S.; Questad, D.; Sammakia, Bahgat

doi:10.1109/itherm.1998.689559

Cited by 5 publications

(4 citation statements)

References 6 publications

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“…Since the late 1980s, the chip has been increasing in size to meet the growing demand on high performance of I/O. Subsequently, the ceramic substrate was replaced by organic substrate because it is not able to adequately support the growing I/O counts due to its inherent limitation in thermal cycling reliability, density, and cost of use [5]. However, the use of organic substrate such as FR4 and polyimide has imposed significant thermal stresses on solder joints during thermal loading due to the greater difference in CTE between the chip and organic substrate [4,5].…”

Section: Introductionmentioning

confidence: 99%

“…Subsequently, the ceramic substrate was replaced by organic substrate because it is not able to adequately support the growing I/O counts due to its inherent limitation in thermal cycling reliability, density, and cost of use [5]. However, the use of organic substrate such as FR4 and polyimide has imposed significant thermal stresses on solder joints during thermal loading due to the greater difference in CTE between the chip and organic substrate [4,5]. Thus, the thermo-mechanical stress on solder joints became the cause of common failure of flip-chip package as the stress is induced to the interconnections repeatedly under cyclic thermal loading environment.…”

Section: Introductionmentioning

confidence: 99%

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Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

Kwak

2014

J Mech Sci Technol

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Since the introduction of Cu/low-k as the interconnect material, the chip-package interaction (CPI) has become a critical reliability challenge for flip chip packages. Revision of underfill material must be considered, which compromises the life of flip chip interconnect by releasing the stresses transferred to the silicon devices from the solder bumps, and thereby maintain the overall package reliability. Thus, it is important to understand the thermo-mechanical behavior of solder bumps. In this study, the solder bump reliability in flip chip package was investigated through an experimental technique and numerical analysis. For the experimental assessment, thermomechanical behavior of solder joints, especially the solder bumps located at the chip corners where most failures usually occur was investigated. Digital image correlation (DIC) technique with optical microscope was utilized to quantify the deformation behavior and strains of cross-sectioned solder bump of flip-chip package subjected to thermal loading from 25°C to 100°C. The results clearly show captured deformations of solder bump under thermal loading. Finally, finite element analysis (FEA) was conducted by simulating the thermal loading applied in the experiments, and validated with experimental results. Then, consistently using the FEA analysis, parametric study for underfill material properties were performed on the reliability of flip chip package, by varying the glass transition temperature (Tg), Young's modulus (E), and coefficient of thermal expansion (CTE). Averaged plastic work of the corner solder bump and stress at the die side were obtained and used as damage indicators for solder bumps and low-k dielectrics layer, respectively. The results show that high Tg, and E of underfill are generally desirable to improve the reliability of solder interconnects in the flip chip package.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

Kwak

2014

J Mech Sci Technol

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“…No clean flux is often used to avoid clear;ing, which is not only cost ineffective but also very difficult for many cases. The flux residues may prevent intimate contacts of .underfill with solder causing voids, delamination, degraded interfacial adhesions (Tran, et al, 1999). So that it is very important to assess the compatibility of fludunderftll materiallprocess in ordcr to have sufficient solder joint lifetime.…”

Section: Introductionmentioning

confidence: 99%

Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

Cheng¹,

Li²,

Qun³

et al. 2003

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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The thermomechanical reliability ofpip chip on board (FCOB) assembly under thermal shock test is addressed in this paper .by invesfigafion of diferenf maferiaflprocess combinations (underfill, flu, repow a:mospheres). /r is verijird thaf solder fafigue is the dominafe failure mechanism and delaminalion hasobvious adverse efect on the solder joint liftime. Periodic solder joint crack is frsi reported in this study ond is defermined lo be related lo glassfber distribution in the PCB.

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“…This residue may prevent intimate contact between underfill and solder causing voids, delamination etc. Even without apparent defects, the flux residue may degrade the adhesion between the underfill material and its surroundings, causing early delamination during reliability tests or device service (Tran et al , 1999). Flux cleaning is not always preferred, as it increases the production cost, and at the same time, it is not easy to achieve sufficient cleaning, as the flip chip gap is always very small.…”

Section: Introductionmentioning

confidence: 99%

Flip chip solder joint reliability under harsh environment

Cheng

Li²,

Qun³

et al. 2003

Soldering & Surface Mount Tech

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Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.

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Adhesion issues in flip-chip on organic modules

Cited by 5 publications

References 6 publications

Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

Flip chip solder joint reliability under harsh environment

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