Adhesion issues in flip-chip on organic modules

Abstract

Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder. Mechanical coupling of the chip and the laminate is done via underfill encapsulant materials. As the chip size increases, the thermal mismatch between silicon and its organic carrier becomes greater. Adhesion becomes an important factor since the C4 joints fail quickly if delamination of the underfill from either chip or the solder mask interface occurs. Newly developed underfills have been studied to examine their properties, including interfacial adhesion strength, flow characteristics, void formation and cure kinetics. This paper will describe basic investigations into the properties of these underfills and also how these properties related to the overall development process.In addition, experiments were performed to determine the effects on adhesion degradation of flip chip assembly processes and materials such as IR reflow profile, flux quantity and residues. Surface treatment of both the chip and the laminate prior to encapsulation were studied to enhance underfill adhesion. Accelerated thermal cycling and highly accelerated stress testing (HAST) were conducted to compare various underfill properties and reliability responses.Index Terms-Chip carrier, electronic package, fracture toughness, interfacial delamination, underfill adhesive.

A novel nanoindentation protocol to characterize surface free energy of superhydrophobic nanopatterned materials

“…microelectronics, microsystem engineering, energy, photonics, tribology, tissue engineering and biomedical devices [1][2][3][4][5][6][7][8][9]. Contact mechanics related problems, such as the uncontrolled adhesion of surfaces with complex shape and geometries, hugely affects the products and their applications in these sectors [10][11][12][13][14]. These problems arise from intertwined physicochemical properties of the contacting surfaces and the interfaces between them.…”

Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin

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