Strain films in the thin film resistance strain gauge are prepared by magnetron sputtering method. Some results concerning the electromechanical and structural properties of nichrome (Ni80Cr20 wt.%) thin films are presented. As compared to the well-known Ni-Cu (constantan) alloy film, which are widely used for manufacturing pressure and force sensors, nichrome (Ni80Cr20 wt.%) thin films exhibit gauge factor values of the same order of magnitude, but they are much more corrosion resistant and adherent to the substrate. The influences of composition and post-deposition annealing on the electrical resistance, temperature coefficient of resistance (TCR) and gauge factor of nichrome (Ni80Cr20 wt.%) thin films are discussed.
Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.
In the paper, the effects of the foaming temperature and holding time on the quality of the foam glass were investigated by means of the different foaming technology. The results indicated that lots of the defects, such as the non-uniform size of the bubbles, big hole and the pit at the bottom, were caused by the high foaming temperature. The fine pore structure was formed by the low temperature. The molding and properties of the foaming glass was affected by the length of the heat preservation time. The rate of acceptability and the mechanical property of the foam glass can be effectively improved by the optimized foaming technology.
Diamond spherical shell thick film was prepared by high power DC-plasma jet CVD.
Atom force microscopy, scanning electron microscopy, Raman spectroscopy and
roughness-profile-meter were used to characterize microstructure, morphology, impurities and
orientation evolution of diamond spherical shell thick film. The results show that, when nucleation
begins, grains grow random orientation. The grain size of spherical diamond film prepared is
compact, clear, uniform, continuous and no remarkable bigger grain over the whole surface of film.
On the growth surface, (100) facets were dominant, and the cross-section SEM indicated that film
columnar spreading grew from the substrate surface to the diamond film surface. The roughness of
the growth surface was much more than that of the nucleation surface. To adjust some important
parameters as methane concentrate, depositing time, and matrix temperature, and high quality
diamond spherical shell thick film was deposited.
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