Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method

Abstract

Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.

Laser-Induced Exothermic Bonding of SiCp/Al Composites with Nanostructured Al/Ni Energetic Interlayer

“…However, SiCp/Al composites have poor machinability and are difficult to use in manufacturing large or complex components [8]. Assembling modular SiCp/Al composite parts by welding can break through the limitations of component size and structure, thus significantly broadening their application and achieving huge economic benefits [9,10]. However, due to the huge difference in physical and chemical properties between the SiC particle and the Al matrix, the welding of SiCp/Al composites is difficult [11].…”

Bonding SiCp/Al Composites via Laser-Induced Exothermic Reactions

“…Particle-reinforced aluminum matrix composites, such as SiCp/Al composites [1], Si 3 N 4 /Al composites [2], SiO 2 /Al composites [3], Al 2 O 3 /Al composites [4], B 4 C/Al composites [5], and TiC/Al composites [6], process excellent electrical and chemical properties, as well as the comprehensive mechanical performances, and have been important structural materials in aerospace, electronics, and automobile industries. Among them, the SiCp/Al composites are particularly attracting attention and are usually used to manufacture components with complex structures in practical applications [7,8].…”

Effect of Ni–Al2O3 nanocomposite coating thickness on transient liquid phase bonding of Al 6061 MMC

“…The composition of the interlayer has also been shown by MacDonald and Eagar4 to be equally as important as the interlayer thickness. In the published literature, it has been shown that pure metal interlayer such as nickel, 5 5,6 silver 7 7,8 and copper 8 8,9 can react with the metal surface by means of eutectic or peritectic reaction to displace surface oxides. In joints made using these pure interlayers, the existing problems can be summarised as parent metal dissolution particulate segregation,8 – 10 void formation in particle segregated region7 and low strength microbonds at particle/metal interfaces resulting from the poor wettability of molten interlayer on ceramic reinforcement 7 …”