Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.
The structural feature and technical indexes of 2A14 aluminum alloy connecting rod was analyzed. The pouring system of gravity die-casting process was initially designed according to the technical requirements. The gravity filling and solidification stages in the permanent mold were simulated by ProCAST. The simulation results show that the casting defects are predicted and the casting process are improved. The most possible section of crack defects are the transition part between the shaft and the connecting rod small or big end.
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