Investigation on Strain Films in the Thin Film Resistance Strain Gauge

Chen, Rong Fa; Zuo, Dun Wen; Sun, Yixuan; Li, Duo Sheng; Lu, Wen Zhuang; Wang, Min

doi:10.4028/www.scientific.net/kem.375-376.690

Cited by 3 publications

(3 citation statements)

References 9 publications

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“…The annealing process may have induced changes in the TFR microstructure and=or film stress, which affected the electrical behaviour of the resistors. A decrease in resistance has previously been observed [16][17][18][19][20][21] and attributed to structural changes (grain-size growth or precipitation). The resistor values were usually stabilized after thermal annealing, via oxidation of chromium, which forms a passivation layer.…”

Section: Resultsmentioning

confidence: 76%

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Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Driad

Krieg

Geldmacher

et al. 2011

J. Electrochem. Soc.

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We report a systematic study of nickel chrome (NiCr) thin film resistors (TFRs) used as resistors in InP-based monolithic microwave integrated circuits (MMICs). The effects of fabrication process parameters (such as surface treatments or thermal cycles) and substrate materials on the electrical properties of NiCr TFRs are discussed. After completion of MMIC fabrication, the NiCr thin film resistors were found to exhibit lower sheet resistance (R sh ) as compared to the as-deposited films. The origin of this variation has been found to be mainly related to the post-NiCr thermal cycles involved in the IC process technology. In contrast, the R sh values of NiCr TFRs deposited on GaAs or SiN x coated substrates were almost unaffected by thermal annealing. Hence, a thin SiN x passivation layer on the InP substrate has been integrated in the InP-based MMIC process to avoid the NiCr-InP interaction. As a result, NiCr thin film resistors with high sheet resistance uniformity and reproducibility, as well as low temperature coefficient of resistance (TCR) have been achieved. Moreover, the use of a SiN x layer on the InP substrate was also found to improve the inter-device isolation.Although novel material resistors have been developed, nickel chromium (NiCr), and tantalum nitride (TaN) remain the thin film resistors (TFRs) of choice for most applications in the microelectronic industry because of their wide resistivity range, low temperature coefficient of resistance (TCR), good reproducibility and good compatibility with various integrated circuit technologies. In particular, NiCr and related materials have been the subject of numerous investigations, 1-12 covering different aspects of deposition techniques and material properties, as well as potential applications.In monolithic microwave integrated circuit (MMIC) technologies, TFRs are extensively used in feedback circuits, bias circuits, and as terminations. Owing to their properties, they are particularly attractive components for analog and mixed signal circuits, which require precise control of the resistance and thermal stability of the TFR, such as operational amplifiers, and analog to digital converters (ADCs).NiCr resistors are usually deposited as very thin layers (tens of nanometers), directly on the substrate or on dielectric polymer layer, using standard sputtering or e-beam evaporation techniques. As for other thin film resistors, the TCR and resistance of NiCr has, however, been reported to be affected by various process parameters (temperature, composition) and environmental conditions, 2,7,8 which might be at the origin of various performance and reliability problems encountered in integrated circuit.Concerning the properties of NiCr films deposited on III-V substrates, only a few results have, so far, been reported in the literature. Shen et al. 1 compared the characteristics of NiCr, TaN and NiV (nickel vanadium) thin film resistors intended for use in GaAsbased power amplifiers. While TaN and NiV TFRs were directly sputtered on GaAs substrates, NiCr fi...

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Section: Resultsmentioning

confidence: 76%

“…A decrease in resistance has previously been observed [16][17][18][19][20][21] and attributed to structural changes (grain-size growth or precipitation). The resistor values were usually stabilized after thermal annealing, via oxidation of chromium, which forms a passivation layer.…”

Section: Resultsmentioning

confidence: 96%

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Driad

Krieg

Geldmacher

et al. 2011

J. Electrochem. Soc.

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“…Various strain sensor networks have been widely used for structural health monitoring. Traditional strain monitoring techniques normally rely on discrete sensing elements such as strain gauges, fiber brag gratings (FBG) [2,3], etc. However, these sensor networks suffer from drawbacks including restricted structural coverage and low damage sensitivity due to the low density of measurement locations [4].…”

Section: Introductionmentioning

confidence: 99%

A Modified Principal Component Analysis Method for Honeycomb Sandwich Panel Debonding Recognition Based on Distributed Optical Fiber Sensing Signals

Chen,

Ma,

Wang

et al. 2024

SDHM

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The safety and integrity requirements of aerospace composite structures necessitate real-time health monitoring throughout their service life. To this end, distributed optical fiber sensors utilizing back Rayleigh scattering have been extensively deployed in structural health monitoring due to their advantages, such as lightweight and ease of embedding. However, identifying the precise location of damage from the optical fiber signals remains a critical challenge. In this paper, a novel approach which namely Modified Sliding Window Principal Component Analysis (MSWPCA) was proposed to facilitate automatic damage identification and localization via distributed optical fiber sensors. The proposed method is able to extract signal characteristics interfered by measurement noise to improve the accuracy of damage detection. Specifically, we applied the MSWPCA method to monitor and analyze the debonding propagation process in honeycomb sandwich panel structures. Our findings demonstrate that the training model exhibits high precision in detecting the location and size of honeycomb debonding, thereby facilitating reliable and efficient online assessment of the structural health state.

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MEMS Piezoresistive Pressure Sensor Based on Flexible PET Thin-Film for Applications in Gaseous-Environments

et al. 2022

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Investigation on Strain Films in the Thin Film Resistance Strain Gauge

Cited by 3 publications

References 9 publications

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

A Modified Principal Component Analysis Method for Honeycomb Sandwich Panel Debonding Recognition Based on Distributed Optical Fiber Sensing Signals

MEMS Piezoresistive Pressure Sensor Based on Flexible PET Thin-Film for Applications in Gaseous-Environments

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