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Dedicated to Professor Dr. K. W. BOER on the occasion of his 70th birthday Thermal infrared sensors with maximal sensitivity and minimal response time require radiation absorbing layers with small heat capacity and high absorbance. In the near infrared these conditions are well met by black gold layers. In order to examine the question whether black gold layers are suitable absorbers as well in the far infrared, their reflectance is measured in a wave number range from k = 14 to 650 cm-', corresponding to a range in wavelength 1 = l / k between 15 and 710 pm.The samples are prepared at various residual gas pressures. The influence of tempering o m the absorbance and the spectral absorption behavior at low temperatures is discussed. The experimental results may be accounted for by a dielectric function according to the Bergman formalism. The spectral dependence of the absorption coefficient and the real and imaginary parts of the refractive index following from it are presented.

The Cassini spacecraft orbiting Saturn carries the composite infrared spectrometer (CIRS) designed to study thermal emission from Saturn and its rings and moons. CIRS, a Fourier transform spectrometer, is an indispensable part of the payload providing unique measurements and important synergies with the other instruments. It takes full advantage of Cassini's 13-year-long mission and surpasses the capabilities of previous spectrometers on Voyager 1 and 2. The instrument, consisting of two interferometers sharing a telescope and a scan mechanism, covers over a factor of 100 in wavelength in the mid and far infrared. It is used to study temperature, composition, structure, and dynamics of the atmospheres of Jupiter, Saturn, and Titan, the rings of Saturn, and surfaces of the icy moons. CIRS has returned a large volume of scientific results, the culmination of over 30 years of instrument development, operation, data calibration, and analysis. As Cassini and CIRS reach the end of their mission in 2017, we expect that archived spectra will be used by scientists for many years to come.

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This paper describes a nano-scale tensile test to study the fatigue properties of LPCVD silicon nitride thin films using a novel electrostatic actuator design. Mechanical-amplifier devices made in silicon nitride thin films can apply controllable tensile stress (2.0-7.8 GPa) to test structures with relatively low actuation voltages (5.7-35.4 V RMS) at the resonant frequencies of the devices. The test devices are fabricated using a surface micromachining technique in combination with deep reactive ion etching and ion milling. With the recently developed experimental techniques inside a focused-ion-beam system, in situ fatigue measurements are performed on silicon nitride test structures with beam widths of 200 nm. The silicon nitride test structures are found to exhibit time-delayed failures with continuous increases in their compliance. By reducing the applied tensile stress to 3.8 GPa, the test structures can survive cyclic loadings up to 10 8 cycles.

Micro Electromechanical System (MEMS) microshutter arrays are being developed at NASA Goddard Space Flight Center for use as a field selector of the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). The microshutter arrays are designed for the spontaneous selection of a large number of objects in the sky and the transmission of light to the NIRSpec detector with high contrast. The JWST environment requires cryogenic operation at 35K. Microshutter arrays are fabricated out of silicon-on-insulator (SOI) silicon wafers. Arrays are closepacked silicon nitride membranes with a pixel size of 100x200 m. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. Light shields are processed for blocking light from gaps between shutters and frames. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes multi-layer metal depositions, the patterning of magnetic stripes and shutter electrodes, a reactive ion etching (RIE) to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch to form mechanical supporting grids and release shutters from the silicon substrate. An additional metal deposition is used to form back electrodes. Shutters are actuated by a magnetic force and latched using an electrostatic force. Optical tests, addressing tests, and life tests are conducted to evaluate the performance and the reliability of microshutter arrays.