1993
DOI: 10.1016/0924-4247(93)80085-u
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Thin metal films as absorbers for infrared sensors

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Cited by 37 publications
(18 citation statements)
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“…[5] Most recent developments in this field are attained using silver thin films. [5,6] Other technologically relevant applications of silver thin films include the surface-plasmon enhancement of fluorescence, luminescence and Raman scattering, [7,8] high temperature superconducting systems, [9] anti-bacterial layers, [10] absorbers for infrared sensors, [11] waveguides, [12] and catalysis. [13,14] Silver thin films are mostly grown by physical vapor deposition (PVD), electrochemical deposition, and electroless methods.…”
Section: Introductionmentioning
confidence: 99%
“…[5] Most recent developments in this field are attained using silver thin films. [5,6] Other technologically relevant applications of silver thin films include the surface-plasmon enhancement of fluorescence, luminescence and Raman scattering, [7,8] high temperature superconducting systems, [9] anti-bacterial layers, [10] absorbers for infrared sensors, [11] waveguides, [12] and catalysis. [13,14] Silver thin films are mostly grown by physical vapor deposition (PVD), electrochemical deposition, and electroless methods.…”
Section: Introductionmentioning
confidence: 99%
“…The absorbance of thin metal films is independent of the wavelength of the radiation, as long as the radiation frequency is smaller than the reciprocal collision time of the electrons in the metal film, which can be described as the relaxation rate ω c in Drude model [15]. Drude metal exhibits a frequency dependent complex resistivity, is the angular frequency of incident radiation and ρ 0 is its DC resistivity.…”
Section: Multi-band Absorber Using Silicon Nitride/nano-chromiummentioning
confidence: 99%
“…[5,6] Silver layers can be produced by many deposition techniques, e.g., galvanic, sol±gel, [7] photochemical deposition, [8] thermal evaporation, [9] or pulsed laser deposition. [10] CVD is an alternative method of growing high purity films, particularly relevant to the metallization of microelectronic and optical devices.…”
Section: Introductionmentioning
confidence: 99%