To augment the quality of our life, fully compliant personalized advanced health-care electronic system is pivotal. One of the major requirements to implement such systems is a physically flexible high-performance biocompatible energy storage (battery). However, the status-quo options do not match all of these attributes simultaneously and we also lack in an effective integration strategy to integrate them in complex architecture such as orthodontic domain in human body. Here we show, a physically complaint lithium-ion micro-battery (236 μg) with an unprecedented volumetric energy (the ratio of energy to device geometrical size) of 200 mWh/cm 3 after 120 cycles of continuous operation. Our results of 90% viability test confirmed the battery's biocompatibility. We also show seamless integration of the developed battery in an optoelectronic system embedded in a threedimensional printed smart dental brace. We foresee the resultant orthodontic system as a personalized advanced health-care application, which could serve in faster bone regeneration and enhanced enamel health-care protection and subsequently reducing the overall health-care cost.
skin, [3,4] stretchable displays, [5,6] and so on. In particular, mechanically deformable energy-harvesting [7,8] and energystorage [9][10][11] devices are crucial for achieving efficacy and portability. Unlike flexibility which can be achieved by thinning down the material such that the generated strain is below its fracture limit, stretchability may involve out-of-plane deformation and reversible change of material size and thus should be tackled differently. [12] The early demonstrations of stretchable energy devices such as batteries [13] and supercapacitors [14] are based on the dispersion of electronic components in inherently elastic materials such as elastomers. Bao and co-workers reported the first intrinsically stretchable solar cell using organic materials which can accommodate reversible strains up to 27% with a power conversion efficiency of ≈2%. [15] The development of different organic-based elastic photovoltaics followed; however, the major drawbacks lie in their environmental instability and low efficacy (below 8%). [16][17][18] In contrast, semiconductor based solar cells show higher efficiencies; however, they are inherently rigid and brittle. To overcome these constraints, various forms of shape engineering were developed such as serpentine, wavy, and stiff-island structures [19][20][21] which can achieve stretching due to different mechanisms such as out-of-plane deformation, buckling, and twisting. [22] The first inorganic semiconductor-based stretchable solar cell was reported by Rogers and co-workers where single junction GaAs microcells (3.6-µm-thick) were transferred onto a prestrained elastomer with downward buckled interconnects resulting in an efficiency of ≈13% with strains up to 20%. [23] In a follow-up work, the authors used ultrathin and geometrically structured dual junction GaInP-GaAs microcells to achieve 60% stretchability and 19% efficiency at the expense of a 33% loss of active area. [24] However, all of the demonstrated inorganic semiconductor based stretchable photovoltaics necessitate an aligned transfer printing of the ultrathin and patterned inorganic material from a crystalline wafer onto a prestrained elastic substrate with good adhesion and low alignment mismatch. [25] Previously, we demonstrated a deep reactive ion etching (DRIE) based linear-corrugation technique to convert rigid solar cells Stretchable solar cells are of growing interest due their key role in realizing many applications such as wearables and biomedical devices. Ultrastretchability, high energy-efficiency, biocompatibility, and mechanical resilience are essential characteristics of such energy harvesting devices. Here, the development of wafer-scale monocrystalline silicon solar cells with world-record ultrastretchability (95%) and efficiency (19%) is demonstrated using a laser-patterning based corrugation technique. The demonstrated approach transforms interdigitated back contacts (IBC) based rigid solar cells into mechanically reliable but ultrastretchable cells with negligible degradation in the...
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Flexible solar cells have received growing attention recently because of their ever-increasing range of applications. Here, the development of ultraflexible, lightweight, and high efficiency (19%) monocrystalline silicon solar cells with excellent reliability, mechanical resilience, and thermal performance is demonstrated by applying a corrugation method combined with laser patterning. The flexing mechanism converts large-scale rigid photovoltaic cells with interdigitated back contacts (IBCs) into a flexible version with a preserved efficiency. The corrugation technique is based on the formation of patterned grooves in active silicon to achieve ultraflexibility. As a result, islands of silicon with different shapes are obtained which are interconnected through the IBCs. Multiple corrugation patterns such as linear, honeycomb, and octagonal designs are studied, each resulting in different flexing capabilities in terms of flexing directionality and minimum bending radius, in addition to providing an atypical appearance with an aesthetic appeal. The corrugation method is shown to improve thermal dissipation (14.6% lower temperature) and to relieve the thermal mismatch challenge compared to the rigid cells because of the finlike architecture. Finally, encapsulation using a transparent polymeric material enables a robust performance of the flexible cells when exposed to different environmental conditions such as acid rain, snow, and mechanical shocks.
Emerging classes of concentrator photovoltaic (CPV) modules reach efficiencies that are far greater than those of even the highest performance flat-plate PV technologies, with architectures that have the potential to provide the lowest cost of energy in locations with high direct normal irradiance (DNI). A disadvantage is their inability to effectively use diffuse sunlight, thereby constraining widespread geographic deployment and limiting performance even under the most favorable DNI conditions. This study introduces a module design that integrates capabilities in flat-plate PV directly with the most sophisticated CPV technologies, for capture of both direct and diffuse sunlight, thereby achieving efficiency in PV conversion of the global solar radiation. Specific examples of this scheme exploit commodity silicon (Si) cells integrated with two different CPV module designs, where they capture light that is not efficiently directed by the concentrator optics onto large-scale arrays of miniature multijunction (MJ) solar cells that use advanced III-V semiconductor technologies. In this CPV + scheme ("+" denotes the addition of diffuse collector), the Si and MJ cells operate independently on indirect and direct solar radiation, respectively. On-sun experimental studies of CPV + modules at latitudes of 35.9886°N (Durham, NC), 40.1125°N (Bondville, IL), and 38.9072°N (Washington, DC) show improvements in absolute module efficiencies of between 1.02% and 8.45% over values obtained using otherwise similar CPV modules, depending on weather conditions. These concepts have the potential to expand the geographic reach and improve the cost-effectiveness of the highest efficiency forms of PV power generation.photovoltaics | multijunction solar cells | concentration optics | diffuse light capture T he levelized cost of electricity (LCOE) is a primary metric that defines the economic competitiveness of photovoltaic (PV) approaches to electrical power generation (1). As the performance of the highest efficiency single-junction flat-plate PV modules begins to reach theoretical limits, research toward cost reductions in such technologies shifts from performance to topics related to materials utilization and manufacturing (2-5). By contrast, the efficiencies of multijunction (MJ) solar cells based on III-V compound semiconductors continue to improve steadily, at a rate of ∼1% per year over the last 15 y, due largely to progress in epitaxial growth processes, mechanical stacking techniques, and microassembly methods for adding junctions that further maximize light absorption and minimize carrier thermalization losses (6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20). Record MJ cell efficiencies now approach ∼46.0%, with realistic pathways to the 50% milestone (5). For economic deployment, however, the sophistication and associated costs of these cells demand the use of lenses, curved mirrors, or other forms of optics in conjunction with a mechanical tracker to geometrically concentrate incident direct sunlight in a manner tha...
Additional Information:Question ResponsePlease submit a plain text version of your cover letter here.If you are submitting a revision of your manuscript, please do not overwrite your original cover letter. There is an opportunity for you to provide your responses to the reviewers later; please do not add them here.7th June 2017 Dr. Esther Levy Editor-in-Chief, Advanced Materials Technologies Dear Dr. Levy, Please find the manuscript titled, "Modular Lego-electronics". Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80 % will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here we show, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor (CMOS) based ICs into modular Lego-electronics with unique geometry that are physically identifiable to ease manufacturing and enhance throughput. We grove various geometry at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (50 m extra) allows targeted site binding like DNA assembly. Different geometries, angles, heights for different modules provide a unique identity to each of the ICs. The two level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The performances of assembled ICs offer uncompromised electrical performance, higher yield and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.As reviewers we suggest the following leading authorities:1.William E. Abstract:Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80 % will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. We show, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor (CMOS) based ICs into modular Lego-electronics with unique geometry that are physically identifiable to ease manufacturing and enhance throughput. We groove various geometry at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (50 m extra) allows targeted site binding like DNA assembly. Different geometries, angles, heights for different modules provide a unique identity to each of t...
High performance thin film transistor with low temperature atomic layer deposition nitrogen-doped ZnO
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