͑Doc. ID 74779͒ The goal of the research program that we describe is to break the emerging performance wall in microprocessor development arising from limited bandwidth and density of on-chip interconnects and chip-to-chip (processor-tomemory) electrical interfaces. Complementary metal-oxide semiconductor compatible photonic devices provide an infrastructure for deployment of a range of integrated photonic networks, which will replace state-of-the-art electrical interconnects, providing significant gains at the system level. Scaling of wavelength-division-multiplexing (WDM) architectures using high-indexcontrast (HIC) waveguides offers one path to realizing the energy efficiency and density requirements of high data rate links. HIC microring-resonator filters are well suited to support add-drop nodes in dense WDM photonic networks with high aggregate data rates because they support high Q's and, due to their traveling-wave character, naturally support physically separated input and drop ports. A novel reconfigurable, "hitless" switch is presented that does not perturb the express channels either before, during, or after reconfiguration. In addition, multigigahertz operation of low-power, Mach-Zehnder silicon modulators as well as germanium-on-silicon photodiodes are presented.
The strain dependence of Si–Ge interdiffusion in epitaxial Si∕Si1−yGey∕Si heterostructures on relaxed Si1−xGex substrates has been studied using secondary ion mass spectrometry, Raman spectroscopy, and simulations. At 800 and 880 °C, significantly enhanced Si–Ge interdiffusion is observed in Si∕Si1−yGey∕Si heterostructures (y=0.56, 0.45, and 0.3) with Si1−yGey layers under compressive strain of −1%, compared to those under no strain. In contrast, tensile strain of 1% in Si0.70Ge0.30 layer has no observable effect on interdiffusion in Si∕Si0.70Ge0.30∕Si heterostructures. These results are relevant to the device and process design of high mobility dual channel and heterostructure-on-insulator metal oxide semiconductor field effect transistors.
Annealing effects on hole and electron mobility in dual-channel structures consisting of strained Si and Si1−yGey on relaxed Si1−xGex layers (x=0.3/y=0.6, and x=0.5/y=0.8) were studied. Hole mobility decreases sharply, but electron mobility is quite immune to annealing conditions of 800 °C, 30 min or 900 °C, 15 s. The hole mobility decrease is more severe in dual-channel structures with higher Ge contents. Hole mobility degradation is a direct result of Ge outdiffusion from the Si1−yGey layer, and the resulting decreased Ge content. Ge diffusion preferentially towards the Si1−xGex buffer layer, rather than the Si cap layer, is a reason that electron mobility is highly immune to such annealing.
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