We demonstrate a three-dimensional direct-write lithography system capable of writing deeply buried, localized index structures into diffusion-mediated photopolymer. The system is similar to that used for femtosecond writing in glass, but has a number of advantages including greater flexibility in the writing media and the ability to use low power, inexpensive, continuous-wave lasers. This system writes index structures both parallel and perpendicular to the writing beam in different types of photopolymers, providing control over the feature size and shape. We demonstrate that this system can be used to create single-mode waveguides that are deeply embedded in the photopolymer medium.
Paper describes the method ofpreparing of hard glass layers on silicon substrates. The thickness of the wafers run fromfiw to one hundred micrometers. Hard glass layers are applied for microwave semiconductor components as passivation or layers or thick dielectric supports for beam-leads contacts to reduce parasitic capacitance.
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