State-of-the-art tire pressure monitoring systems (TPMS) are wireless sensor nodes mounted on the rim. Attaching the node on the inner liner of a tire allows sensing of additional technical parameters, such as road condition, tire wearout, temperature, tire friction, side slip, wheel speed, and vehicle load. They may be used for improved tracking and engine control, feedback to the power train and car-to-car communication purposes.

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The following paper presents a 2.1 GHz transceiver, which makes use of BAW resonators to replace the external quartz crystal and the external band select filter. It has been fabricated in a 130 nm CMOS process and has a power consumption of 5 mA. To derive the specifications for the transceiver the requirements of a TPMS have been taken into consideration.Der Einsatz von BAW-Resonatoren fü r drahtlose Sensornetzwerke im automotiven Bereich.Der folgende Artikel stellt einen 2,1-GHz-Transceiver vor, der anstelle einer externen Quarzreferenz und eines externen Hochfrequenzfilters BAW-Resonatoren einsetzt. Der Chip wurde in einem 130-nm-CMOS-Prozess gefertigt und hat einen Stromverbrauch von 5 mA. Um die Spezifikationen abzuleiten, wurden die Anforderungen an ein TPMS (Reifendruckü berwachungssystem) betrachtet.

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In the field of wireless sensor node design a wide range of new potentials are opened by means of emerging 3D integration technologies. These technologies enable the design of highly integrated sensor nodes, but the designers face novel challenges, which specialized communications engineers are not familiar with. This work presents an advanced direct tire pressure monitoring system (TPMS) with an overall size below 1 cm3 applying through silicon vias (TSV) and points out two selected design issues arising due to this high level of integration. At first design issues caused by temperature gradients within the 3D integrated chip stack are presented. Multi physics simulations show that a systematical temperature measurement error is introduced by self heating, which would affect the communication performance if unconsidered. Furthermore the radio frequency (RF) characteristics of TSVs, focusing on their electrical efficiency, are investigated. In particular the behavior of TSVs for connecting a bulk acoustic wave resonator with an impedance of 2 kX at 2.1 GHz is evaluated in detail