We present a micrometer scale, on-chip integrated, plasmonic enhanced graphene photodetector (GPD) for telecom wavelengths operating at zero dark current. The GPD is designed and optimized to directly generate a photovoltage and has an external responsivity∼12.2V/W with a 3dB bandwidth∼42GHz. We utilize Au split-gates with a∼100nm gap to electrostatically create a p-n-junction and simultaneously guide a surface plasmon polariton gap-mode. This increases light-graphene interaction and optical absorption and results in an increased electronic temperature and steeper temperature gradient across the GPD channel. This paves the way to compact, on-chip integrated, power-efficient graphene based photodetectors for receivers in tele and datacom modules.The ever-growing demand for global data traffic[1] is driving the development of next generation communication standards [2,3]. The increasing numbers of connected devices[4], the need for new functionalities, and the development of high-performance computing [5,6] require optical communication systems performing at higher speeds, with improved energy-efficiency, whilst maintaining scalability and cost-effective manufacturing. Si photonics[7-9] offers the prospect of dense (nanoscale) integration[10] relying on mature, low-cost (based on complementary metal-oxide-semiconductor (CMOS) fabrication processes) manufacturing [8,9], making it one of the key technologies for short-reach (<10km) optical interconnects[11] beyond currently employed lithium niobate[12] and indium phosphate[13]. A variety of functionalities have been developed and demonstrated in Si photonics for local optical interconnects[11]. Electro-optic modulators based on carrier-depletion (phase-modulation) in Si[14, 15] or the Franz-Keldysh effect[16] (amplitude-modulation) in strained Si-Ge[17, 18] encode information into optical signals at telecom wavelengths (λ =1.3-1.6µm). On the receiver side, Ge[19] or bonded III-V[20, 21] photodetectors (PD) are needed for optical-to-electrical signal conversion, since the telecom photon energies are not sufficient for direct (band-to-band) photodetection in Si[22].On-chip integrated Ge PDs [23][24][25][26][27] are standard components in Si photonics foundries [8,9,22]. Their external responsivities (in A/W), R I = I ph /P in , where I ph is the photocurrent and P in is the incident optical power, can exceed 1A/W [8,23] and their bandwidth can reach 60GHz [25][26][27]. Following the development of high temperature (> 600 • C) [19] heterogeneous integration of Ge-on-Si using epitaxial growth and cyclic thermal annealing [19,28,29], the concentration of defects and threading dislocations in Ge epilayers and at Si/Ge interfaces can be reduced [19], resulting in low (<10nA[9, 27]) dark current in waveguide integrated Ge p-i-n photodiodes [24,27]. However, Ge-on-Si integration is a complex process [19,22,29], as the lattice mismatch between Si and Ge [19], ion implantation [23,25], thermal budget (i.e. thermal energy transfer to the wafer) management [22], and the non-plan...

Graphene and related materials can lead to disruptive advances in next-generation photonics and optoelectronics. The challenge is to devise growth, transfer and fabrication protocols providing high (≥5000 cm 2 V –1 s –1 ) mobility devices with reliable performance at the wafer scale. Here, we present a flow for the integration of graphene in photonics circuits. This relies on chemical vapor deposition (CVD) of single layer graphene (SLG) matrices comprising up to ∼12000 individual single crystals, grown to match the geometrical configuration of the devices in the photonic circuit. This is followed by a transfer approach which guarantees coverage over ∼80% of the device area, and integrity for up to 150 mm wafers, with room temperature mobility ∼5000 cm 2 V –1 s –1 . We use this process flow to demonstrate double SLG electro-absorption modulators with modulation efficiency ∼0.25, 0.45, 0.75, 1 dB V –1 for device lengths ∼30, 60, 90, 120 μm. The data rate is up to 20 Gbps. Encapsulation with single-layer hexagonal boron nitride (hBN) is used to protect SLG during plasma-enhanced CVD of Si 3 N 4 , ensuring reproducible device performance. The processes are compatible with full automation. This paves the way for large scale production of graphene-based photonic devices.

We report compact, scalable, high-performance, waveguide integrated graphene-based photodetectors (GPDs) for telecom and datacom applications, not affected by dark current. To exploit the photothermoelectric (PTE) effect, our devices rely on a graphene/polymer/graphene stack with static top split gates. The polymeric dielectric, poly(vinyl alcohol) (PVA), allows us to preserve graphene quality and to generate a controllable p−n junction. Both graphene layers are fabricated using aligned single-crystal graphene arrays grown by chemical vapor deposition. The use of PVA yields a low charge inhomogeneity ∼8 × 10 10 cm −2 at the charge neutrality point, and a large Seebeck coefficient ∼140 μV K −1 , enhancing the PTE effect. Our devices are the fastest GPDs operating with zero dark current, showing a flat frequency response up to 67 GHz without roll-off. This performance is achieved on a passive, low-cost, photonic platform, and does not rely on nanoscale plasmonic structures. This, combined with scalability and ease of integration, makes our GPDs a promising building block for next-generation optical communication devices.

Phase change materials (PCMs) are highly attractive for nonvolatile electrical and all-optical memory applications because of unique features such as ultrafast and reversible phase transitions, long-term endurance, and high scalability to nanoscale dimensions. Understanding their transient characteristics upon phase transition in both the electrical and the optical domains is essential for using PCMs in future multifunctional optoelectronic circuits. Here, we use a PCM nanowire embedded into a nanophotonic circuit to study switching dynamics in mixed-mode operation. Evanescent coupling between light traveling along waveguides and a phase-change nanowire enables reversible phase transition between amorphous and crystalline states. We perform time-resolved measurements of the transient change in both the optical transmission and resistance of the nanowire and show reversible switching operations in both the optical and the electrical domains. Our results pave the way toward on-chip multifunctional optoelectronic integrated devices, waveguide integrated memories, and hybrid processing applications.

We report on a C-band double layer graphene electro-absorption modulator on a passive SOI platform showing 29GHz 3dB-bandwith and NRZ eye-diagrams extinction ratios ranging from 1.7 dB at 10 Gb/s to 1.3 dB at 50 Gb/s. Such high modulation speed is achieved thanks to the quality of the CVD pre-patterned single crystal growth and transfer on wafer method that permitted the integration of high-quality scalable graphene and low contact resistance. By demonstrating this high-speed CVD graphene EAM modulator integrated on Si photonics and the scalable approach, we are confident that graphene can satisfy the main requirements to be a competitive technology for photonics.

One of the main challenges of next generation optical communication is to increase the available bandwidth while reducing the size, cost and power consumption of photonic integrated circuits. Graphene has been recently proposed to be integrated with silicon photonics to meet these goals because of its high mobility, fast carrier dynamics and ultra-broadband optical properties. We focus on graphene photodetectors for high speed datacom and telecom applications based on the photo-thermo-electric effect, allowing for direct optical power to voltage conversion, zero dark current, and ultra-fast operation. We report on a chemical vapour deposition graphene photodetector based on the photo-thermoelectric effect, integrated on a silicon waveguide, providing frequency response >65 GHz and optimized to be interfaced to a 50 Ω voltage amplifier for direct voltage amplification. We demonstrate a system test leading to direct detection of 105 Gbit s−1 non-return to zero and 120 Gbit s−1 4-level pulse amplitude modulation optical signals.

2-step chemical cleaning allows enhanced removal of polymeric residues from the surface of graphene, leading to significantly improved electrical and morphological properties.

We propose and experimentally demonstrate capacitive actuation of a graphene-silicon micro-ring add/drop filter. The mechanism is based on a silicon-SiO 2 -graphene capacitor on top of the ring waveguide. We show the capacitive actuation of the add/drop functionality by a voltage-driven change of the graphene optical absorption. The proposed capacitive solution overcomes the need for continuous heating to keep tuned the filter's in/out resonance and therefore eliminates "in operation" energy consumption.