In this paper, a novel tactile image-sensor with detection ability of two-dimensional distributions of object hardness and contact-force is presented. Actuating the sensing diaphragm by small pressure vibration, plural information of the object on the tactile image-sensor can be detected with the same sensing elements on it. Hardness distribution of touching object is detected simultaneously with distribution of static contact-force, since their signals are processed separately in frequency domain. In addition, since vibrating sensor surface is highly sensitive to slight contact-force, initial point of object touching with below 500µN force was successfully detected at the same time.
In this paper, a robust and sensitive silicon-MEMS tactile-imager which realizes scratch resistance and over-range protection is presented. This concept of tactile-imager can solve the fragility problem of sensitive structure without any protective materials, using backside silicon surface as contact-face. Also, backside contact-face is very suitable for tactile sensors since electronic terminals in the circuits can be removed from the contact-face side. Fabricated tactile-imager showed high robustness in scratch resistance tests with #120 emery-papers. In addition, over-ranged input ( 1.68N) applied to 10O[m-silicon diaphragm was safely received. Robustness of the tactile-imager has been much improved using the concept without degradation of the original force sensitivity and spatial resolution.
In this study, fingertip-size integrated silicon tactile sensor-membrane for three-dimensional (3D) surface-shape imaging system has been newly developed. The sensing area is 8mmφ-area and several-µm thickness silicon membrane. It is swollen like a balloon surface and strain sensor pixel is arrayed on it for detection of surface shape. The movable device structure is fabricated by CMOS compatible post micromachining with SOI wafers. Totally integrated device packaging technology was also developed for surface-shape imaging system. Experimental demonstration of real-time imaging/reading of 3D Braille surface' is presented for the first time. In this system, nearly 1µm depth resolution is realized at 1Hz-bandwidth by highly sensitive silicon sensor structure with enough robustness in use.
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