Three dimensional surface-shape tactile imager with fingertip-size silicon integrated sensor-membran

Abstract

In this study, fingertip-size integrated silicon tactile sensor-membrane for three-dimensional (3D) surface-shape imaging system has been newly developed. The sensing area is 8mmφ-area and several-µm thickness silicon membrane. It is swollen like a balloon surface and strain sensor pixel is arrayed on it for detection of surface shape. The movable device structure is fabricated by CMOS compatible post micromachining with SOI wafers. Totally integrated device packaging technology was also developed for surface-shape imaging system. Experimental demonstration of real-time imaging/reading of 3D Braille surface' is presented for the first time. In this system, nearly 1µm depth resolution is realized at 1Hz-bandwidth by highly sensitive silicon sensor structure with enough robustness in use.

A Self-Scanned Active-Matrix Tactile Sensor Realized Using Silicon-Migration Technology

“…Among a range of strain-sensing mechanisms [16]- [18], simple piezoresistive sensing was implemented in this study. Two n-type piezoresistors, R 1 and R 2 (Fig.…”

CMOS tactile sensor systems

“…as finger print detectors [7,8], and process control [9,10]. Sensor specifications such as sensing principle, property to be determined, e.g.…”

“…SENSING ELEMENTS CMOS-based tactile sensor systems used in various application scenarios most often make use of capacitive or piezoresistive sensing elements. Depending on the required sensitivity and mechanical stiffness of piezoresistive tactile sensors, silicon chips have been locally thinned to membranes [7,13], and flexible beam-based structures [14] using CMOScompatible MEMS processing.…”