A Self-Scanned Active-Matrix Tactile Sensor Realized Using Silicon-Migration Technology

Zeng, Fanlin; Wong, Man

doi:10.1109/jmems.2014.2344025

Cited by 8 publications

(5 citation statements)

References 20 publications

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“…This emerging technology is very promising not only for the pressure sensors, but also for MEMS. Cross-section of the sealed cavity [25] .…”

Section: Discussionmentioning

confidence: 99%

“…Various tools, such as Raman spectroscopy, secondary ion mass spectroscopy (SIMS), scanning electron microscopy (SEM), transmission electron microscopy (TEM), atomic force microscopy (AFM), etc., have been utilized to characterize the properties of the silicon membranes over sealed cavities [19][20][21][22][23][24][25][26][27][28] . No defects were observed at the migrated silicon region.…”

Section: Surface Flatness and Roughnessmentioning

confidence: 99%

“…Hao et al from Japan proposed a capacitive absolute pressure sensor by using the silicon migration technology [25] . As shown in Fig.…”

Section: Capacitive Pressure Sensorsmentioning

confidence: 99%

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A review: crystalline silicon membranes over sealed cavities for pressure sensors by using silicon migration technology

Zhang

Guoping

et al. 2018

J. Semicond.

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A silicon pressure sensor is one of the very first MEMS components appearing in the microsystem area. The market for the MEMS pressure sensor is rapidly growing due to consumer electronic applications in recent years. Requirements of the pressure sensors with low cost, low power consumption and high accuracy drive one to develop a novel technology. This paper first overviews the historical development of the absolute pressure sensor briefly. It then reviews the state of the art technology for fabricating crystalline silicon membranes over sealed cavities by using the silicon migration technology in detail. By using only one lithographic step, the membranes defined in lateral and vertical dimensions can be realized by the technology. Finally, applications of MEMS through using the silicon migration technology are summarized.

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“…This emerging technology is very promising not only for the pressure sensors, but also for MEMS. Cross-section of the sealed cavity [25] .…”

Section: Discussionmentioning

confidence: 99%

Section: Surface Flatness and Roughnessmentioning

confidence: 99%

See 1 more Smart Citation

A review: crystalline silicon membranes over sealed cavities for pressure sensors by using silicon migration technology

Zhang

Guoping

et al. 2018

J. Semicond.

View full text Add to dashboard Cite

show abstract

“…Recently an innovative usage of this mechanism in microfabrication was proposed. It has been shown that buried cavities/microchannels can be self-assembled simply by annealing a prestructured silicon wafer at high temperature [43,44], without masks and bonding process. This technique also allows monolithic integration of MEMS-COMS [44], thus avoiding the material-and process-incompatibility issues inherent in the traditional integration schemes.…”

Section: First Example: Inverse Design For Surface Diffusion Induced ...mentioning

confidence: 99%

“…It has been shown that buried cavities/microchannels can be self-assembled simply by annealing a prestructured silicon wafer at high temperature [43,44], without masks and bonding process. This technique also allows monolithic integration of MEMS-COMS [44], thus avoiding the material-and process-incompatibility issues inherent in the traditional integration schemes. Multiple microchannels with complicated architecture have been fabricated [45], and subattogram mass sensing and an active-matrix tactile sensor have also been demonstrated based on this fabrication technique [43,44].…”

Section: First Example: Inverse Design For Surface Diffusion Induced ...mentioning

confidence: 99%

Deep learning–based inverse method for layout design

Zhang

2019

Struct Multidisc Optim

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Layout design with complex constraints is a challenging problem to solve due to the non-uniqueness of the solution and the difficulties in incorporating the constraints into the conventional optimization-based methods. In this paper, we propose a design method based on the recently developed machine learning technique, Variational Autoencoder (VAE). We utilize the learning capability of the VAE to learn the constraints and the generative capability of the VAE to generate design candidates that automatically satisfy all the constraints. As such, no constraints need to be imposed during the design stage. In addition, we show that the VAE network is also capable of learning the underlying physics of the design problem, leading to an efficient design tool that does not need any physical simulation once the network is constructed. We demonstrated the performance of the method on two cases: inverse design of surface diffusion induced morphology change and mask design for optical microlithography.

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Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Han,

Huang,

et al. 2023

Microsyst Nanoeng

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Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctionality, smaller chip size, and smaller package size, have recently emerged. The demand for performance upgradation has led to breakthroughs in sensor materials, design, fabrication, and packaging methods, which have emerged frequently in recent decades. This paper reviews common new trends in MEMS pressure sensors, including minute differential pressure sensors (MDPSs), resonant pressure sensors (RPSs), integrated pressure sensors, miniaturized pressure chips, and leadless pressure sensors. To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the “beam-membrane-island” sensor design exhibits the best performance of 66 μV/V/kPa with a natural frequency of 11.3 kHz. In high-accuracy applications, silicon and quartz RPS are analyzed, and both materials show ±0.01%FS accuracy with respect to varying temperature coefficient of frequency (TCF) control methods. To improve MEMS sensor integration, different integrated “pressure + x” sensor designs and fabrication methods are compared. In this realm, the intercoupling effect still requires further investigation. Typical fabrication methods for microsized pressure sensor chips are also reviewed. To date, the chip thickness size can be controlled to be <0.1 mm, which is advantageous for implant sensors. Furthermore, a leadless pressure sensor was analyzed, offering an extremely small package size and harsh environmental compatibility. This review is structured as follows. The background of pressure sensors is first presented. Then, an in-depth introduction to MEMS pressure sensors based on different application scenarios is provided. Additionally, their respective characteristics and significant advancements are analyzed and summarized. Finally, development trends of MEMS pressure sensors in different fields are analyzed.

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A Self-Scanned Active-Matrix Tactile Sensor Realized Using Silicon-Migration Technology

Cited by 8 publications

References 20 publications

A review: crystalline silicon membranes over sealed cavities for pressure sensors by using silicon migration technology

A review: crystalline silicon membranes over sealed cavities for pressure sensors by using silicon migration technology

Deep learning–based inverse method for layout design

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

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