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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick-film and LTCC microresistors (with designed dimensions between 50 £ 50 mm 2 and 800 £ 200 mm 2 ). Design/methodology/approach -The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution) as well as long term thermal stability and durability of microresistors to short electrical pulses. Findings -Fodel process gives better resolution than standard screen-printing and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties. Originality/value -Presents systematic studies of a wide spectrum of geometrical and electrical properties of thick-film and LTCC microresistors.

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The paper reports some results of a cooperation research in which the possibility to realize microfluidic components and modules by using low temperature cofiring ceramic multilayer (LTCC-ML) technology is examined. The main goal is the development of LTCC multilayer which are carrier for microfluidic Silicon components and combine electrical and fluidic fimctions. Also fluidic mixer elements and hybrid microvalves were developed. These different components are combined during the examinations to realize a microscope chamber. This is a fluidic microsystem to inspect and treatment smallest samples for life science applications. It can be used in high resolution microscopes. The microscope chamber consists of a LTCC manifold which contains fluidic channels and forms the carrier for assembled microfluidic and electric silicon components.

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Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier-transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy-based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.