Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging

Abstract

Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier-transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy-based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.

Experimental measurement of moisture distribution in the adhesive layer using near‐infrared spectroscopy

“…Furthermore, the strength and toughness are calculated by inputting the changes in the physical property according to the amount of moisture absorption 12,24–33 . In some studies, the amount of water absorption has been experimentally investigated by monitoring the changes in the strain, 22,34 which are induced by the swelling associated with moisture absorption, and changes in the modulus, 35 or by using electrochemical impedance spectroscopy 36 . Fourier‐transform infrared (FTIR)‐transmission microscopy has been used to measure the diffusion of D 2 O in the adhesive layer, 37,38 but there are very few experimental examples of non‐destructive observations of water distribution in the adhesive layer.…”

“…12,[24][25][26][27][28][29][30][31][32][33] In some studies, the amount of water absorption has been experimentally investigated by monitoring the changes in the strain, 22,34 which are induced by the swelling associated with moisture absorption, and changes in the modulus, 35 or by using electrochemical impedance spectroscopy. 36 Fourier-transform infrared (FTIR)-transmission microscopy has been used to measure the diffusion of D 2 O in the adhesive layer, 37,38 F I G U R E 1 Schematic of the (a) open-faced specimen and (b) closed specimen.…”

Detection and quantification of defect evolution at buried metal-oxide-polymer interface on rough substrate by local electrochemical impedance mapping

“…Polymer coated metals are among the most used combinations in hybrid materials and composite materials designed for multiple applications, from structural materials in building, automotive, aerospace industries [1,2,3] to electronic devices [4] and medical disposals [5]. In many cases these assemblies arise from the necessity to combine mechanical strength of metallic substrates with improved life time, offered by protective polymer coatings.…”

Degradation studies of epoxy coatings on printed circuit boards after pressure cooker test

“…Complemented by Fourier‐transformed infrared spectroscopy (FTIR), the EIS is a powerful tool to study the degradation of polymers and associated corrosion phenomena as published by several research groups [ 29–31 ] and recently applied by the authors to study the degradation of adhesives on electroless plated gold layers on printed circuit board (pcb). [ 32 ]…”

“…Complemented by Fourier-transformed infrared spectroscopy (FTIR), the EIS is a powerful tool to study the degradation of polymers and associated corrosion phenomena as published by several research groups [29][30][31] and recently applied by the authors to study the degradation of adhesives on electroless plated gold layers on printed circuit board (pcb). [32] The approach of the present work is the evaluation of the state of degradation of epoxy-coatings on copper metalized pcb after various exposition times in the PCT by using the EIS supplemented by FTIR. Thereby, the impedance spectra were discussed, based on well-known equivalent circuits and reflecting the initial properties and application quality of the coatings and their degradation due to multiple corrosion loads.…”