The present study focuses mainly on non-electrochem. investigation of thin barrier-like oxide films formed under different pulse frequencies. The TEM investigation principally shows amorphous oxide films, which are dense and free of pores. The various pulse expts. have no influence on these film properties. The oxide growth factor was calcd. to 1.06 nmV-1 in all cases. The microstructure (crystallog. orientation, grain boundaries) of the underlying substrate does not affect the oxide films. Independent of the pulse frequency, electrolyte species are not incorporated into the oxide films. The evidenced differences in the film thickness are caused by intrinsic peculiarities of the high-field mechanism of growing oxide
The present study investigates the interplay between ongoing bath aging during the anodizing process and the formation and properties of the anodic formed oxide layers on AA 1050 in sulfuric acid. The change in the bath over the time of use is studied by controlling the conductivity of the bath. The pH value and the concentration of Al3+ ions in the bath are simultaneously measured. The kinetic of the oxide formation depending on the bath aging is electrochemically investigated by repetitive potential controlled anodizing of reference samples. Supplementary material diagnostics by SEM and infrared reflection–absorption spectroscopy show a significant decrease of the oxide film thickness as well as the molecular composition with ongoing bath aging.
Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier-transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy-based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.
The present work investigates the passive film formation and properties on tin and tin solder alloys in weakly acidic nitrate solution by using conventional electrochemical methods as well as electrochemical impedance spectroscopy and Mott-Schottky analysis. It is observed that the influence of the main alloying elements, antimony and copper, positively influences the formation and properties of native oxide films on the respective alloys. If the oxide film is anodically formed, the process can be interpreted as a high-field mechanism. In this case, antimony, as well as copper, increases the electron conductivity of the anodic formed layers analogous to the transparent conducting oxide layers (e.g., ATO layers).
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