Every temperature change induces stress between the module components due to the thermo-mechanical mismatch, which results in a displacement of solar cells in the module and therefore loads the solar cell interconnectors in between. As a result a limiting factor of solar module lifetime is the fatigue behaviour of these electrical cell interconnectors: the copper-ribbons. The purpose of this work is a quantitative estimation of the thermo-mechanical induced strain in the ribbons during service. For this purpose specially prepared solar cells were laminated to a solar module in an industrial process line and filmed during thermal cycling tests. Finally, the loading conditions on the ribbon were assessed by a previously developed lifetime model based on mechanical fatigue testing procedures

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We propose an improved system that enables simultaneous excitation and measurements of at least two resonance frequency spectra of a vibrating atomic force microscopy (AFM) cantilever. With the dual resonance excitation system it is not only possible to excite the cantilever vibrations in different frequency ranges but also to control the excitation amplitude for the individual modes. This system can be used to excite the resonance frequencies of a cantilever that is either free of the tip-sample interactions or engaged in contact with the sample surface. The atomic force acoustic microscopy and principally similar methods utilize resonance frequencies of the AFM cantilever vibrating while in contact with the sample surface to determine its local elastic modulus. As such calculation demands values of at least two resonance frequencies, two or three subsequent measurements of the contact resonance spectra are necessary. Our approach shortens the measurement time by a factor of two and limits the influence of the AFM tip wear on the values of the tip-sample contact stiffness. In addition, it allows for in situ observation of processes transpiring within the AFM tip or the sample during non-elastic interaction, such as tip fracture.

Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nanotubes has opened new possibilities to face challenges better. Carbon Nanotubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nanotube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nanotube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.

The part of electronics packaging is steadily forced to adapt the requirements of the microelectronic industry. For future electronics application such needs will be: 1) steady miniaturisation of the electronic devices 2) high pin count up to 5000 i / o per device 3) pitches down to 20 mum 4) higher current density per devices 5) higher thermal dissipation loss This is only a small extract of the challenges facing the electronics packaging industry in the future. The aim and duty for electronics packaging is to realize a reliable package for future electronics. Commonplace materials for joining elements like solder are not able to solve these requirements. For example in [1] the authors describe that future IC's operating at high frequencies of 10-28 GHz, signal bandwidths of 20 Gbps and lower supply voltages require an estimated maximum of R (< 10 mOhm), L (<5-10pH) and C (<5-10 fF).[l] Current joining elements can not meet these requirements. To solve these problems the electronics packaging industry researches technologies and materials of the nanotechnology. Especially researches concerning new materials for electronics packaging rise up since the last three years. One of the most researched new materials are Carbon Nanotubes (CNT). Carbon Nanotubes have superior mechanical, electrical and thermal properties. Due to these properties CNT are considered as promising candidates in packaging technology. The most interesting field of application is the use of the Carbon Nanotubes as filler in electrical conductive adhesives. The aim is to improve the performance of conductive adhesives in comparison to common products. This study deals with characterization of carbon nanotube / epoxy adhesives in electronics packaging. For this study we optimize the CNT - adhesive system by modification of the CNT, use of different dispersion technologies and under variation of the epoxy matrix. The resulting adhesives are characterized by measuring their viscosity, mech- anical strength and their thermal and electrical conductivity. For all studies Multi Wall Nanotubes were used which can be purchased at a reasonable price. For modification of the CNT they can be treated by low pressure plasma (cvd), UV / ozone treatment or modifiedchemically in solution to achieve a higher polarity resulting in a better dispersibility. Also bonding to the polymer matrix is improved. Success of the processes is studied by XPS and REM. For dispersion technology ultrasonic bath, speed mixing and/or treatment with a roll calander can be used. The polymer matrix is also varied in order to achieve an appropriate viscosity at the CNT-content of interest that enables good results in screen printing. Also CNT-polymer interaction can be adapted by varying polarity of the resin used. The distribution of CNT in the matrix is studied by TEM. The first investigations show that ultrasonic finger is the favourable dispersion technology to achieve well dispersed CNT. For modification of the CNT the plasma treatment came out to be efficient to give appropriate am...

The failure mechanism of lead-free solder interconnections of chip scale package-sized Ball Grid Array (BGA) component boards under thermal cycling was studied by employing cross-polarized light microscopy, scanning electronic microscopy, electron backscatter diffraction, and nanoindentation. It was determined that the critical solder interconnections were located underneath the chip corners, instead of the corner most interconnections of the package, and the highest strains and stresses were concentrated at the outer neck regions on the component side of the interconnections. Observations of the failure modes were in good agreement with the finite element results. The failure of the interconnections was associated with changes of microstructures by recrystallization in the strain concentration regions of the solder interconnections. Coarsening of intermetallic particles and the disappearance of the boundaries between the primary Sn cells were observed in both cases. The nanoindentation results showed lower hardness of the recrystallized grains compared with the nonrecrystallized regions of the same interconnection. The results show that failure modes are dependent on the localized microstructural changes in the strain concentration regions of the interconnections and the crack paths follow the networks of grain boundaries produced by recrystallization.

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