We demonstrate a record-high extinction-ratio of 50.4 dB in a 2 × 2 silicon Mach-Zehnder switch equipped with a variable splitter as the front 3-dB splitter. The variable splitter is adjusted to compensate for the splitting-ratio mismatch between the front and rear 3-dB splitters. The high extinction ratio does not rely on waveguide crossings and meets a strong demand in applications to multiport circuit switches. Large fabrication tolerance will make the high extinction ratio compatible with a volume production with standard complementary metal-oxide semiconductor fabrication facilities.
We demonstrate a 32 × 32 path-independent-insertion-loss optical path switch that integrates 1024 thermooptic Mach-Zehnder switches and 961 intersections on a small, 11 × 25 mm2 die. The switch is fabricated on a 300-mm-diameter silicon-on-insulator wafer by a complementary metal-oxide semiconductor-compatible process with advanced ArF immersion lithography. For reliable electrical packaging, the switch chip is flip-chip bonded to a ceramic interposer that arranges the electrodes in a 0.5-mm pitch land grid array. The on-chip loss is measured to be 15.8 ± 1.0 dB, and successful switching is demonstrated for digital-coherent 43-Gb/s QPSK signals. The total crosstalk of the switch is estimated to be less than -20 dB at the center wavelength of 1545 nm. The bandwidth narrowing caused by dimensional errors that arise during fabrication is discussed.
A precise flip-chip bonding (FCB) technology for indium phosphide semiconductor optical amplifiers (InP-SOAs) on a silicon photonics platform within less than ±1-µm alignment accuracy was developed. For efficient optical coupling and a relaxed alignment tolerance, the mode field on both the InP-SOAs and the Si waveguides was expanded by spot-size converters (SSCs). On the InP-SOAs, width-tapered SSCs were used to obtain an isotropic mode-field having an approximately a 3-µm diameter. On the silicon photonics platform, dual-core SSCs were used to expand the same mode-field size of 3 µm as for the SSCs on SOAs. Using the FCB technology and the SSCs, an in-line optical amplification of 15 dB was achieved by in-line integrated SOAs with angled waveguides. The optical coupling losses were 7.7 dB, which included 5.1-dB excess losses by misalignment and a gap between InP-SOA and Si waveguides. A 4 × 4 Si switch with a hybrid-integrated 4-ch SOA array was fabricated, and achieved the first demonstration of a lossless Si switch.
We report on a path-independent insertion-loss (PILOSS) 8 × 8 matrix switch based on Si-wire waveguides, which has a record-small footprint of 3.5 × 2.4 mm2. The PILOSS switch consists of 64 thermooptic Mach-Zehnder (MZ) switches and 49 low-crosstalk intersections. Each of the MZ switches and intersections employs directional couplers, which enable the composition of a low loss PILOSS switch. We demonstrate successful switching of digital-coherent 43-Gbps QPSK signal.
Ultra-fast carrier decay, recently discovered in a hydrogenated amorphous silicon waveguide, can be exploited for pattern-effect-free all-optical signal processing based on optical Kerr nonlinearity. In this study, we utilized a 10 Gbit/s RZ-OOK data stream as a pump for degenerate four-wave mixing in a low-loss hydrogenated amorphous silicon waveguide. The propagation loss of the waveguide used was 1.0±0.2 dB/cm at 1550 nm. Unlike crystalline silicon waveguides, no noticeable difference was observed in the BER characteristics between the cases of PRBS 2(7)-1 and 2(31)-1.
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