The application of X‐Ray lithography in mass production of devices is only economically viable if resist materials of highest sensitivity can be provided. Chemical amplification is the key concept to achieve such performance. It is outlined for a highly sensitive three component positive tone X‐Ray resist, consisting of a Novolak binder matrix, a starter compound, which—on X‐Ray exposure—yields an acid, which catalytically decomposes a dissolution inhibitor. Resist performance is discussed in terms of reaction kinetics and their implications on resist response, simulation, and handling procedures.
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